SCHEMBL175503

SCHEMBL175503

O=C(O)C1(CC2(C(=O)O)CCC3OC3C2)CCC2OC2C1

nearest known ligand 0.35

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 2/20 0.35
TP53 P04637 2/20 0.35
NFKB1 P19838 2/20 0.35
THPO P40225 2/20 0.35
GMNN O75496 2/20 0.35
LMNA P02545 2/20 0.35
PMP22 Q01453 2/20 0.35
CYP2C19 P33261 2/20 0.35
STAT6 P42226 1/20 0.35
HIF1A Q16665 1/20 0.35
NPC1 O15118 1/20 0.35
MTOR P42345 1/20 0.35
RAB9A P51151 1/20 0.35
BLM P54132 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
KDM4E B2RXH2 1/20 0.34
TFPI2 P48307 1/20 0.34
TSHR P16473 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16005 0.89 MAPK1 (0.35) MAPK1TP53NFKB1THPOGMNN
SCHEMBL16443833 0.87 CYP2C19 (0.37) MAPK1TP53NFKB1THPOGMNN
SCHEMBL1473744 0.87 MAPK1 (0.37) MAPK1TP53NFKB1THPOGMNN
SCHEMBL1860545 0.85 MAPK1 (0.37) MAPK1TP53NFKB1THPOGMNN
SCHEMBL741407 0.85 MAPK1 (0.37) MAPK1TP53NFKB1THPOGMNN
SCHEMBL741406 0.85 MAPK1 (0.37) MAPK1TP53NFKB1THPOGMNN
SCHEMBL29784882 0.81 MAPK1 (0.31) MAPK1TP53NFKB1THPOGMNN
SCHEMBL20913174 0.81 MAPK1 (0.31) MAPK1TP53NFKB1THPOGMNN
SCHEMBL11869383 0.81 MAPK1 (0.31) MAPK1TP53NFKB1THPOGMNN
SCHEMBL28910883 0.81 MAPK1 (0.34) MAPK1TP53NFKB1THPOGMNN

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9718986-B2 Epoxy resin blend TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2017-08-01 US disclosed
US-9150742-B2 Linear polyester resins and improved lithographic inks SUN CHEMICAL CORPORATION (US) 2015-10-06 US disclosed
US-20140228471-A1 LINEAR POLYESTER RESINS AND IMPROVED LITHOGRAPHIC INKS SUN CHEMICAL CORPORATION (US) 2014-08-14 US disclosed
EP-2751164-A2 LINEAR POLYESTER RESINS AND IMPROVED LITHOGRAPHIC INKS Sun Chemical Corporation (US) 2014-07-09 EP disclosed
US-20140161982-A1 EPOXY RESIN BLEND TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2014-06-12 US disclosed
WO-2013033360-A2 LINEAR POLYESTER RESINS AND IMPROVED LITHOGRAPHIC INKS SUN CHEMICAL CORPORATION (US) 2013-03-07 WO disclosed
US-20120055704-A1 EPOXY RESIN BLEND TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2012-03-08 US disclosed
US-20100255740-A1 EPOXY RESIN BLEND TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2010-10-07 US disclosed
US-7294660-B2 Contains aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property ASAHI DENKA CO., LTD. (JP) 2007-11-13 US disclosed
US-20050176854-A1 Epoxy resin composition ASAHI DENKA CO (JP) 2005-08-11 US disclosed
US-20030158286-A1 Active energy beam-curable composition BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-08-21 US disclosed