SCHEMBL1758336

SCHEMBL1758336

CCO[Si](CCCNc1nc(S)nc(S)n1)(OCC)OCC

nearest known ligand 0.31

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
DNM2 P50570 1/20 0.31
SLC29A1 Q99808 1/20 0.31
KCNH3 Q9ULD8 1/20 0.30
KMT2A Q03164 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP2C19 P33261 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29806035 0.98 DNM2 (0.33) DNM2SLC29A1KMT2A
SCHEMBL29806198 0.98 DNM2 (0.31) DNM2SLC29A1
SCHEMBL1758197 0.98 DNM2 (0.31) DNM2SLC29A1
SCHEMBL30033261 0.88 CYP1A2 (0.38) DNM2SLC29A1KCNH3KMT2ACYP1A2
SCHEMBL29915404 0.85 SLC29A1 (0.30) SLC29A1
SCHEMBL29915328 0.85 SLC29A1 (0.30) SLC29A1
SCHEMBL29941116 0.84
SCHEMBL29940841 0.84
SCHEMBL21979385 0.84
SCHEMBL21979335 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3632533-B1 AIRFLOW GENERATION DEVICE AND ITS MANUFACTURING METHOD ASAHI RUBBER INC (JP) 2024-10-30 EP disclosed
CN-111344874-B Thermoelectric conversion device 株式会社朝日精细橡胶研究所 2024-10-22 CN disclosed
CN-118829067-A Laminate, method for producing same, and use of laminate DIC株式会社 2024-10-22 CN disclosed
EP-3712971-B1 THERMOELECTRIC CONVERSION DEVICE ASAHI FR R&D CO LTD (JP) 2024-10-09 EP disclosed
CN-117597801-A Conductive substrate for battery electrode and method for manufacturing same JSR株式会社 2024-02-23 CN disclosed
CN-117203301-A Surface treatment method, surface treatment agent, method for producing joined body, method for producing substance having conductor coating, method for producing substance having coating film formed thereon, method for producing conductor-coated resin base material, method for producing waveguide, method for producing circuit board or antenna, and compound JSR株式会社 2023-12-08 CN disclosed
US-11683986-B2 Thermoeletric conversion device ASAHI FR R&D CO., LTD. (JP) 2023-06-20 US disclosed
CN-115706057-A Mounting structure and method for manufacturing same JSR株式会社 2023-02-17 CN disclosed
US-20230045816-A1 THERMOELECTRIC CONVERSION STRUCTURE ASAHI RUBBER INC. (JP) 2023-02-16 US disclosed
WO-2023282228-A1 CONDUCTIVE SUBSTRATE FOR BATTERY ELECTRODES AND METHOD FOR PRODUCING SAME JSR株式会社 2023-01-12 WO disclosed
US-20150290911-A1 Method of Manufacturing Joined Body of Fiber-Reinforced Composite Material and Metal Member, and Fiber-Reinforced Composite Material Used for the Method TEIJIN LIMITED (JP) 2015-10-15 US disclosed
US-20150221413-A1 CONDUCTOR AND METHOD OF MANUFACTURING THE SAME ALPS ALPINE CO., LTD. (JP) 2015-08-06 US disclosed
EP-2871039-A1 METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL-METAL MEMBER BONDED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL USED IN SAME Teijin Limited (JP) 2015-05-13 EP disclosed
US-20150064409-A1 Method for Manufacturing Joint Member and Joint Member TEIJIN LIMITED (JP) 2015-03-05 US disclosed
EP-2832526-A1 METHOD FOR MANUFACTURING JOINT MEMBER, AND JOINT MEMBER Teijin Limited (JP) 2015-02-04 EP disclosed
US-20130272780-A1 Joint Member and Method for Producing the Same, and Method for Producing Metal Composite Molded Product TEIJIN LIMITED (JP) 2013-10-17 US disclosed
EP-2623572-A1 BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND Mori, Kunio (JP) 2013-08-07 EP disclosed
US-20130177770-A1 BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND SULFUR CHEMICAL INSTITUTE INCORPORATED (JP) 2013-07-11 US disclosed
US-20110168430-A1 METHOD OF FORMING METAL WIRING AND ELECTRONIC PART INCLUDING METAL WIRING PIONEER CORPORATION (JP) 2011-07-14 US disclosed
US-20110104505-A1 LAMINATED BODY AND CIRCUIT WIRING BOARD SULFUR CHEMICAL LABORATORY INCORPORATED (JP) 2011-05-05 US disclosed