⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15265892 | 0.77 | — | — | |
| SCHEMBL2790089 | 0.77 | — | — | |
| SCHEMBL11568655 | 0.75 | — | — | |
| SCHEMBL87611 | 0.75 | — | — | |
| SCHEMBL16166598 | 0.75 | — | — | |
| SCHEMBL569861 | 0.74 | ALDH1A1 (0.52) | — | |
| SCHEMBL3652188 | 0.74 | ALDH1A1 (0.52) | — | |
| SCHEMBL17209104 | 0.74 | ALDH1A1 (0.41) | — | |
| SCHEMBL4243340 | 0.72 | — | — | |
| SCHEMBL170266 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115605635-A | Silver/tin electroplating bath and method of use | 麦克德米德乐思公司（US） | 2023-01-13 | — | — | CN | claimed |
| US-10772822-B2 | Molecularly imprinted polymers and their use as antidandruff agents | L'OREAL (FR) | 2020-09-15 | — | — | US | claimed |
| EP-2938641-B1 | MOLECULARLY IMPRINTED POLYMERS AND THEIR USE AS ANTIDANDRUFF AGENTS | ORÉAL L (FR) | 2016-08-24 | — | — | EP | claimed |
| US-20150342859-A1 | MOLECULARLY IMPRINTED POLYMERS AND THEIR USE AS ANTIDANDRUFF AGENTS | L'OREAL (FR) | 2015-12-03 | — | — | US | claimed |
| EP-2938641-A1 | MOLECULARLY IMPRINTED POLYMERS AND THEIR USE AS ANTIDANDRUFF AGENTS | L'Oréal (FR) | 2015-11-04 | — | — | EP | claimed |
| EP-2242802-B1 | HYDROLYSIS-RESISTANT POLYAMIDE-ELASTOMER MIXTURES, MOLDED PARTS PRODUCED THEREFROM AND USE THEREOF | EMS PATENT AG (CH) | 2015-10-07 | — | — | EP | claimed |
| WO-2014102206-A1 | MOLECULARLY IMPRINTED POLYMERS AND THEIR USE AS ANTIDANDRUFF AGENTS | L'OREAL (FR) | 2014-07-03 | — | — | WO | claimed |
| EP-1946362-B1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE (US) | 2012-01-11 | — | — | EP | claimed |
| US-20110229672-A1 | Hydrolysis-resistant polyamide-elastomer mixtures, molded articles produced therefrom and their use | RHEIN CHEMIE RHEINAU GMBH (DE) | 2011-09-22 | — | — | US | claimed |
| US-7713859-B2 | Tin-silver solder bumping in electronics manufacture | ENTHONE INC. (US) | 2010-05-11 | — | — | US | claimed |
| JP-2009510255-A | — | — | 2009-03-12 | — | — | JP | claimed |
| EP-1946362-A2 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE, INCORPORATED (US) | 2008-07-23 | — | — | EP | claimed |
| WO-2007022075-A2 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2007-02-22 | — | — | WO | claimed |
| US-20070037377-A1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2007-02-15 | — | — | US | claimed |
| CN-1171561-A | Optical unit and electrolytic solution | SONY CORP (JP) | 1998-01-28 | — | — | CN | claimed |
| EP-0554275-B1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | ATOTECH DEUTSCHLAND GMBH (DE) | 1994-12-14 | — | — | EP | claimed |
| US-3976812-A | Photoconductive cells | EASTMAN KODAK COMPANY (US) | 1976-08-24 | — | — | US | claimed |
| JP-63014734-A | — | — | None | — | — | JP | disclosed |
| US-3976812-A | Photoconductive cells | EASTMAN KODAK COMPANY (US) | 1976-08-24 | — | — | US | disclosed |
| US-3976812-A | Photoconductive cells | EASTMAN KODAK COMPANY (US) | 1976-08-24 | — | — | US | disclosed |