SCHEMBL1766186

SCHEMBL1766186

CCCCCCCCCCCCCCCCCn1cnc(C)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TBXAS1 P24557 1/20 0.47
QPCT Q16769 11/20 0.43
CYP1A2 P05177 1/20 0.42
CYP3A4 P08684 1/20 0.42
CYP2D6 P10635 1/20 0.42
CYP19A1 P11511 1/20 0.42
CYP2C9 P11712 1/20 0.42
CYP2C19 P33261 1/20 0.42
NPC1 O15118 5/20 0.42
RAB9A P51151 5/20 0.42
HTT P42858 4/20 0.42
GALR3 O60755 2/20 0.42
POLB P06746 2/20 0.42
ATM Q13315 2/20 0.42
MAPK1 P28482 2/20 0.42
NPSR1 Q6W5P4 2/20 0.42
LMNA P02545 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
KDM4E B2RXH2 1/20 0.42
HSP90AA1 P07900 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9773448 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
SCHEMBL16321117 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
SCHEMBL9625488 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
SCHEMBL19286072 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
SCHEMBL9625860 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
SCHEMBL2945045 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
SCHEMBL9625581 1.00 TBXAS1 (0.47) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
Hydrochloric Acid SCHEMBL9626085 0.98 TBXAS1 (0.46) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
Bromide SCHEMBL10325056 0.98 TBXAS1 (0.46) TBXAS1QPCTCYP1A2CYP3A4CYP2D6
Iodide SCHEMBL10324529 0.98 TBXAS1 (0.46) TBXAS1QPCTCYP1A2CYP3A4CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3850294-A1 PHASE CHANGE MATERIAL-COATED HEAT EXCHANGE TUBES Henkel IP & Holding GmbH (DE) 2021-07-21 EP disclosed
WO-2020055967-A1 PHASE CHANGE MATERIAL-COATED HEAT EXCHANGE TUBES Henkel IP & Holding GmbH (DE) 2020-03-19 WO disclosed
EP-3328915-A1 NEW HIGH MOLECULAR WEIGHT POLYMERS FROM WASTE RAW MATERIALS Repsol, S.A. (ES) 2018-06-06 EP disclosed
WO-2018073313-A1 NEW HIGH MOLECULAR WEIGHT POLYMERS FROM WASTE RAW MATERIALS REPSOL, S.A. (ES) 2018-04-26 WO disclosed
EP-3049246-A1 PYROLIZED ORGANIC LAYERS AND CONDUCTIVE PREPREGS MADE THEREWITH Henkel IP & Holding GmbH (DE) 2016-08-03 EP disclosed
EP-2969446-A2 PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION Henkel IP & Holding GmbH (DE) 2016-01-20 EP disclosed
EP-2969447-A1 PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION Henkel IP & Holding GmbH (DE) 2016-01-20 EP disclosed
WO-2014149391-A1 PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION Henkel IP & Holding GmbH (DE) 2014-09-25 WO disclosed
WO-2014140803-A2 PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION Henkel IP & Holding GmbH (DE) 2014-09-18 WO disclosed
EP-2558266-A2 CURABLE COMPOSITIONS, PROCESSES FOR USING SUCH COMPOSITIONS TO PREPARE COMPOSITES AND PROCESSES FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION Henkel Corporation (US) 2013-02-20 EP disclosed
EP-1783147-B1 Composition and associated method GEN ELECTRIC (US) 2009-05-13 EP disclosed
WO-2009037323-A2 PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS AND COATINGS HENKEL AG & CO. KGAA (DE) 2009-03-26 WO disclosed
EP-1783147-A1 Composition and associated method GENERAL ELECTRIC COMPANY (US) 2007-05-09 EP disclosed
EP-1782881-A1 Membrane and associated method General Electric Company (US) 2007-05-09 EP disclosed
WO-2004024807-A1 FOAMABLE COMPOSITIONS HENKEL CORPORATION (US) 2004-03-25 WO disclosed
WO-2003087204-A9 CURABLE FOAM ELASTOMERIC COMPOSITIONS HENKEL CORP (US) 2004-02-26 WO disclosed
WO-2003087204-A1 CURABLE FOAM ELASTOMERIC COMPOSITIONS HENKEL CORPORATION (US) 2003-10-23 WO disclosed
WO-2003044089-A1 THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS HENKEL CORPORATION (US) 2003-05-30 WO disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed
EP-0340928-A2 Positively chargeable toner SHIKOKU CHEMICALS CORPORATION (JP) 1989-11-08 EP disclosed