SCHEMBL1768459

SCHEMBL1768459

CC(CCCCCCCN=C=O)N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4576082 1.00
SCHEMBL790640 1.00
SCHEMBL28540524 1.00
SCHEMBL19092955 1.00
SCHEMBL113597 0.98
SCHEMBL4290536 0.98
SCHEMBL11222483 0.94
SCHEMBL15528588 0.93 NAAA (0.41)
SCHEMBL496205 0.92
SCHEMBL28252381 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109749036-A Imine quaternary ammonium salt catalyst and preparation method thereof and low viscosity polyisocyantates composition by the catalyst preparation 万华化学集团股份有限公司 2019-05-14 CN claimed
EP-2219073-A1 New holographic media and photopolymers Bayer MaterialScience AG (DE) 2010-08-18 EP claimed
CN-115884998-B Urea resin composition and polyurea foam 日本井上技术研究所株式会社 2025-05-30 CN disclosed
US-20230272123-A1 PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING PARAMYLON-BASED RESIN NEC CORPORATION (JP) 2023-08-31 US disclosed
US-11591410-B2 Cellulose derivative and resin composition for molding NEC CORPORATION (JP) 2023-02-28 US disclosed
CN-115702181-A Method for recovering polyurethane material 亨斯迈国际有限责任公司 2023-02-14 CN disclosed
US-11572416-B2 Cellulose resin, molding material, molded body, and method for producing cellulose resin NEC CORPORATION (JP) 2023-02-07 US disclosed
CN-115485316-A Polyol block copolymers 艾柯尼克技术有限公司 2022-12-16 CN disclosed
US-20210340282-A1 PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING PARAMYLON-BASED RESIN NEC CORPORATION (JP) 2021-11-04 US disclosed
US-10982009-B2 Cellulose derivative and use thereof NEC CORPORATION (JP) 2021-04-20 US disclosed
US-10934368-B2 Cellulose resin, material for molding, molded body and process for producing cellulose resin NEC CORPORATION (JP) 2021-03-02 US disclosed
WO-2011067057-A1 METHOD FOR PRODUCING A HOLOGRAPHIC FILM BAYER MATERIALSCIENCE AG (DE) 2011-06-09 WO disclosed
WO-2011054795-A1 FLUOROURETHANE AS AN ADDITIVE IN A PHOTOPOLYMER FORMULATION BAYER MATERIALSCIENCE AG (DE) 2011-05-12 WO disclosed
EP-1176168-B1 Thermoplastic resin composition RIKEN TECHNOS CORP (JP) 2006-03-08 EP disclosed
EP-1086991-B1 Thermoplastic elastomeric resin composition and a granule thereof RIKEN TECHNOS CORP (JP) 2004-07-28 EP disclosed
US-6458893-B1 SAPONIFIED ETHYLENE-VINYL ACETATE COPOLYMER OF SPECIFIED ETHYLENE CONTENT AND DEGREE OF SAPONIFICATION AND AN OPTIONALLY HYDROGENATED COPOLYMER OF A VINYL AROMATIC SUCH AS STYRENE WITH A CONJUGATED DIENE SUCH AS ISOPRENE; MOLDABILITY RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-10-01 US disclosed
US-6395833-B1 VULCANIZED BLOCK POLYMER OF (HYDROGENATED) VINYLAROMATIC-CONJUGATED DIENE COPOLYMER KNEADED WITH ALLYLOXYPOLYALKYLENE GLYCOL COMPOUND; ROTATIONAL POWDER MOLDING; WEAR RESISTANCE, AUTOMOBILES RIKEN TECHNOS CORPORATION (JP) 2002-05-28 US disclosed
US-20020028882-A1 Thermoplastic resin composition RIKEN TECHNOS CORPORATION (JP) 2002-03-07 US disclosed
EP-1176168-A2 Thermoplastic resin composition RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-01-30 EP disclosed
EP-1086991-A1 Thermoplastic elastomeric resin composition and a granule thereof RIKEN VINYL INDUSTRY CO., LTD. (JP) 2001-03-28 EP disclosed