Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | TSHR | P16473 | 1/20 | 0.48 |
| ▸ | GAA | P10253 | 3/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
| ▸ | POLB | P06746 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL325076 | 0.85 | ALDH1A1 (0.62) | ALDH1A1TSHRGAAKMT2APOLB | |
| Iodide SCHEMBL8715119 | 0.83 | ALDH1A1 (0.59) | ALDH1A1TSHRGAAKMT2APOLB | |
| SCHEMBL4272715 | 0.74 | — | — | |
| SCHEMBL29163588 | 0.73 | — | — | |
| SCHEMBL4069937 | 0.73 | — | — | |
| SCHEMBL176403 | 0.73 | ALDH1A1 (0.48) | ALDH1A1TSHRGAAKMT2APOLB | |
| SCHEMBL1733093 | 0.71 | — | — | |
| SCHEMBL456759 | 0.71 | — | — | |
| SCHEMBL28461429 | 0.71 | — | — | |
| SCHEMBL13343232 | 0.71 | ALDH1A1 (0.46) | ALDH1A1TSHRGAAKMT2AMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1946362-B1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE (US) | 2012-01-11 | — | — | EP | disclosed |
| US-7713859-B2 | Tin-silver solder bumping in electronics manufacture | ENTHONE INC. (US) | 2010-05-11 | — | — | US | disclosed |
| EP-1946362-A2 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE, INCORPORATED (US) | 2008-07-23 | — | — | EP | disclosed |
| WO-2007022075-A2 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2007-02-22 | — | — | WO | disclosed |
| US-20070037377-A1 | TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE | ENTHONE INC. (US) | 2007-02-15 | — | — | US | disclosed |