Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.48 |
| ▸ | SIGMAR1 | Q99720 | 5/20 | 0.46 |
| ▸ | KDM5A | P29375 | 3/20 | 0.36 |
| ▸ | PHF8 | Q9UPP1 | 3/20 | 0.36 |
| ▸ | KDM2A | Q9Y2K7 | 3/20 | 0.36 |
| ▸ | KDM4C | Q9H3R0 | 2/20 | 0.36 |
| ▸ | KDM4A | O75164 | 1/20 | 0.36 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.34 |
| ▸ | NAAA | Q02083 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17766147 | 1.00 | CYP1A2 (0.48) | CYP1A2SIGMAR1KDM5APHF8KDM2A | |
| SCHEMBL17766130 | 0.98 | CYP1A2 (0.50) | CYP1A2SIGMAR1KDM5APHF8KDM2A | |
| SCHEMBL17766148 | 0.93 | CYP1A2 (0.52) | CYP1A2SIGMAR1EPHX1 | |
| SCHEMBL23521408 | 0.91 | CYP1A2 (0.48) | CYP1A2SIGMAR1EPHX1 | |
| SCHEMBL6112855 | 0.89 | CYP1A2 (0.45) | CYP1A2SIGMAR1EPHX1 | |
| SCHEMBL23521394 | 0.89 | CYP1A2 (0.45) | CYP1A2SIGMAR1EPHX1 | |
| SCHEMBL17766152 | 0.81 | SIGMAR1 (0.48) | CYP1A2SIGMAR1KDM5APHF8KDM2A | |
| SCHEMBL17766114 | 0.81 | SIGMAR1 (0.48) | CYP1A2SIGMAR1KDM5APHF8KDM2A | |
| SCHEMBL3830692 | 0.80 | CYP1A2 (0.39) | CYP1A2SIGMAR1 | |
| SCHEMBL17766144 | 0.79 | CYP1A2 (0.48) | CYP1A2SIGMAR1EPHX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12319815-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-12312494-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| CN-115003759-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-12-01 | — | — | CN | disclosed |
| CN-116917368-A | Curable resin composition and use thereof | 株式会社钟化 | 2023-10-20 | — | — | CN | disclosed |
| CN-114008113-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-05-02 | — | — | CN | disclosed |
| US-20220340777-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-10-27 | — | — | US | disclosed |
| WO-2022202173-A1 | CURABLE RESIN COMPOSITION AND USE THEREOF | 株式会社カネカ | 2022-09-29 | — | — | WO | disclosed |
| CN-115003759-A | Resin composition, method for producing same, and multi-component curable resin composition | 株式会社钟化 | 2022-09-02 | — | — | CN | disclosed |
| CN-110651336-B | Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition | 株式会社钟化 | 2022-05-17 | — | — | CN | disclosed |
| US-20220073747-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-03-10 | — | — | US | disclosed |
| US-10563088-B2 | Photocurable and thermosetting resin composition, cured product, and laminate | KANEKA CORPORATION (JP) | 2020-02-18 | — | — | US | disclosed |
| CN-110651336-A | Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition | 株式会社钟化 | 2020-01-03 | — | — | CN | disclosed |
| CN-107001583-B | Photocurable and thermosetting resin composition, cured product, and laminate | 株式会社钟化 | 2019-06-18 | — | — | CN | disclosed |
| US-10227505-B2 | Active energy ray-curable composition | KANEKA CORPORATION (JP) | 2019-03-12 | — | — | US | disclosed |
| EP-3235845-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | Kaneka Corporation (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170283649-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | KANEKA CORPORATION (JP) | 2017-10-05 | — | — | US | disclosed |
| CN-107001583-A | Photocurable and thermosetting resin composition, cured product, and laminate | 株式会社钟化 | 2017-08-01 | — | — | CN | disclosed |
| CN-105324407-B | Active energy ray-curable composition | 株式会社钟化 | 2017-07-28 | — | — | CN | disclosed |
| US-20160145467-A1 | ACTIVE ENERGY RAY-CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2016-05-26 | — | — | US | disclosed |
| CN-105324407-A | Active energy ray-curable composition | KANEKA CORP | 2016-02-10 | — | — | CN | disclosed |