⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2468972 | 0.94 | — | — | |
| SCHEMBL35859 | 0.78 | — | — | |
| SCHEMBL2572805 | 0.76 | — | — | |
| SCHEMBL15514143 | 0.74 | — | — | |
| SCHEMBL27932438 | 0.73 | ALDH1A1 (0.32) | — | |
| SCHEMBL2572582 | 0.72 | — | — | |
| SCHEMBL504534 | 0.72 | — | — | |
| SCHEMBL5821445 | 0.70 | — | — | |
| SCHEMBL17818696 | 0.70 | — | — | |
| SCHEMBL27674545 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 138 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109305947-B | Oxetane monomer compound and preparation method thereof | 常州强力先端电子材料有限公司（CN） | 2023-01-13 | — | — | CN | claimed |
| CN-110806676-A | Photosensitive resin composition and application thereof | 常州强力先端电子材料有限公司 | 2020-02-18 | — | — | CN | claimed |
| EP-3312211-B1 | CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE | DAICEL CORP (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4703352-A1 | SULFONATE, OXIME SULFONATE, IMIDE SULFONATE, AMIDE SULFONATE, ACID GENERATING AGENT CONTAINING SAID COMPOUND, AND PHOTORESIST CONTAINING SAID ACID GENERATING AGENT | San-Apro Ltd. (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-4613789-A1 | EPOXY COMPOUND PRODUCT | Daicel Corporation (JP) | 2025-09-10 | — | — | EP | disclosed |
| EP-4596230-A1 | MULTILAYER STRUCTURE AND METHOD FOR PRODUCING SAME, AUTOMOBILE PART, AIRCRAFT PART, AND DAMPING MATERIAL FOR CARBON-FIBER-REINFORCED PLASTIC | Mitsubishi Chemical Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-12379525-B2 | Plastic lens | DAICEL CORPORATION (JP) | 2025-08-05 | — | — | US | disclosed |
| US-20250243110-A1 | CURABLE COMPOSITION, UNDERCOAT LAYER, LAMINATE, AND DISPLAY DEVICE | DAICEL CORPORATION (JP) | 2025-07-31 | — | — | US | disclosed |
| US-20250230326-A1 | CURABLE RESIN COMPOSITION, COATING LAYER, LAMINATE, PLASTIC LENS, AND IMAGE DISPLAY DEVICE | DAICEL CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| US-20250178327-A1 | MULTILAYER STRUCTURE AND METHOD FOR PRODUCING SAME, AUTOMOBILE PART, AIRCRAFT PART, AND DAMPING MATERIAL FOR CARBON-FIBER-REINFORCED PLASTIC | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-06-05 | — | — | US | disclosed |
| WO-2025100400-A1 | EPOXY COMPOUND PRODUCT | 株式会社ダイセル | 2025-05-15 | — | — | WO | disclosed |
| EP-2891673-A1 | CURABLE COMPOSITION, CURED PRODUCT THEREOF, OPTICAL MEMBER AND OPTICAL DEVICE | Daicel Corporation (JP) | 2015-07-08 | — | — | EP | disclosed |
| US-8981040-B2 | Cationically polymerizable resin, cationically polymerizable resin composition, and cured products thereof | DAICEL CORPORATION (JP) | 2015-03-17 | — | — | US | disclosed |
| EP-2826799-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT | Daicel Corporation (JP) | 2015-01-21 | — | — | EP | disclosed |
| US-20130315553-A1 | APPARATUS FOR PRODUCING OPTICAL FIBER, METHOD FOR PRODUCING OPTICAL FIBER, AND OPTICAL FIBER PRODUCED BY METHOD | DAICEL CORPORATION (JP) | 2013-11-28 | — | — | US | disclosed |
| US-8426516-B2 | Polymer compound having aroylbiphenylene skeleton and thermocurable film forming polymer composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-20130035465-A1 | RADICAL POLYMERIZABLE RESIN, RADICAL POLYMERIZABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF | DAICEL CORPORATION (JP) | 2013-02-07 | — | — | US | disclosed |
| US-20120309930-A1 | CATIONICALLY POLYMERIZABLE RESIN, CATIONICALLY POLYMERIZABLE RESIN COMPOSITION, AND CURED PRODUCTS THEREOF | DAICEL CORPORATION (JP) | 2012-12-06 | — | — | US | disclosed |
| US-20110118408-A1 | POLYMER COMPOUND HAVING AROYLBIPHENYLENE SKELETON AND THERMOCURABLE FILM FORMING POLYMER COMPOSITION | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2011-05-19 | — | — | US | disclosed |
| WO-2008111640-A1 | OXETHANE RESIN COMPOSITION | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2008-09-18 | — | — | WO | disclosed |