⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Sulfide SCHEMBL29110712 | 0.87 | — | — | |
| SCHEMBL1783641 | 0.87 | — | — | |
| Phosphine SCHEMBL15475257 | 0.87 | — | — | |
| SCHEMBL8836643 | 0.87 | — | — | |
| SCHEMBL21328566 | 0.87 | — | — | |
| SCHEMBL2143586 | 0.82 | — | — | |
| SCHEMBL5754893 | 0.82 | — | — | |
| SCHEMBL11503491 | 0.82 | — | — | |
| SCHEMBL59561 | 0.82 | — | — | |
| SCHEMBL28315322 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 100 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024156770-A1 | PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-08-02 | — | — | WO | claimed |
| EP-4407067-A1 | PLATING BATH COMPOSITION FOR PLATING OF PRECIOUS METAL AND A METHOD FOR DEPOSITING A PRECIOUS METAL LAYER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-07-31 | — | — | EP | claimed |
| CN-115011830-B | Molybdenum cobalt boron ternary boride-based metal ceramic material and preparation method thereof | 河源富马硬质合金股份有限公司 | 2023-09-22 | — | — | CN | claimed |
| CN-115011830-A | Molybdenum-cobalt-boron ternary boride-based metal ceramic material and preparation method thereof | 河源富马硬质合金股份有限公司 | 2022-09-06 | — | — | CN | claimed |
| US-20200232099-A1 | PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD AND A METHOD FOR DEPOSITING A GOLD LAYER | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2020-07-23 | — | — | US | claimed |
| CN-105702630-B | Semiconductor structure and forming method thereof | 中芯国际集成电路制造(上海)有限公司 | 2020-07-10 | — | — | CN | claimed |
| EP-3563432-A1 | PERPENDICULAR SPIN TRANSFER TORQUE MAGNETIC MECHANISM | INTEL Corporation (US) | 2019-11-06 | — | — | EP | claimed |
| US-20190280188-A1 | PERPENDICULAR SPIN TRANSFER TORQUE MAGNETIC MECHANISM | INTEL CORPORATION | 2019-09-12 | — | — | US | claimed |
| CN-110192288-A | PERPENDICULAR SPIN TRANSFER TORQUE MAGNETIC MECHANISM | 英特尔公司 | 2019-08-30 | — | — | CN | claimed |
| CN-107904474-B | A kind of molybdenum cobalt boron Ternary Boride Base Cermets material and preparation method thereof | 北京科技大学 | 2019-06-21 | — | — | CN | claimed |
| CN-107904474-A | A kind of molybdenum cobalt boron Ternary Boride Base Cermets material and preparation method thereof | 北京科技大学 | 2018-04-13 | — | — | CN | claimed |
| CN-104752599-B | Conductive heat dissipation substrate | 财团法人工业技术研究院 | 2018-01-12 | — | — | CN | claimed |
| EP-3144413-A1 | PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD | ATOTECH Deutschland GmbH (DE) | 2017-03-22 | — | — | EP | claimed |
| US-9397279-B2 | Electric conductive heat dissipation substrate | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2016-07-19 | — | — | US | claimed |
| CN-105702630-A | Semiconductor structure and formation method thereof | 中芯国际集成电路制造(上海)有限公司 | 2016-06-22 | — | — | CN | claimed |
| CN-105586582-A | Base layer of non-stick product coating and manufacturing method thereof | HUBEI RONGTAI COOKING UTENSILS CO LTD | 2016-05-18 | — | — | CN | claimed |
| US-20150188016-A1 | ELECTRIC CONDUCTIVE HEAT DISSIPATION SUBSTRATE | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2015-07-02 | — | — | US | claimed |
| CN-104752599-A | Conductive heat dissipation substrate | IND TECH RES INST | 2015-07-01 | — | — | CN | claimed |
| US-8502381-B2 | Barrier layer configurations and methods for processing microelectronic topographies having barrier layers | LAM RESEARCH CORPORATION (US) | 2013-08-06 | — | — | US | claimed |
| US-20050230262-A1 | Electrochemical methods for the formation of protective features on metallized features | SEMITOOL, INC. | 2005-10-20 | — | — | US | claimed |