⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL659205 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL28164274 | 0.97 | — | — | |
| Water SCHEMBL60895 | 0.97 | — | — | |
| SCHEMBL28849565 | 0.97 | LMNA (0.47) | — | |
| SCHEMBL5268 | 0.97 | — | — | |
| SCHEMBL22418727 | 0.94 | PTGS1 (0.48) | — | |
| Butane SCHEMBL25220481 | 0.93 | LMNA (0.45) | — | |
| SCHEMBL20533646 | 0.93 | — | — | |
| SCHEMBL21859089 | 0.93 | — | — | |
| SCHEMBL22581628 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117385426-A | Electrodeposition of copper in microelectronic devices | 麦克德米德乐思公司 | 2024-01-12 | — | — | CN | claimed |
| CN-115074789-B | Circuit board blind hole rapid filling electrolytic copper plating solution and rapid filling method | 深圳市板明科技股份有限公司 | 2022-11-25 | — | — | CN | claimed |
| CN-115074789-A | Circuit board blind hole rapid filling electrolytic copper plating solution and rapid filling method | 深圳市板明科技股份有限公司 | 2022-09-20 | — | — | CN | claimed |
| WO-2020057325-A1 | DETECTION METHOD AND SENSOR FOR L-CYSTEINE BASED ON 3,3'-DITHIOBIS(1-PROPANESULFONIC ACID)-MERCURY COMPOSITE FILM | 长沙理工大学 | 2020-03-26 | — | — | WO | claimed |
| US-20160190007-A1 | A METHOD FOR MICROVIA FILLING BY COPPER ELECTROPLATING WITH TSV TECHNOLOGY FOR 3D COPPER INTERCONNECTION AT HIGH ASPECT RATIO | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2016-06-30 | — | — | US | claimed |
| US-20160168738-A1 | Additive for Reducing Voids after Annealing of Copper Plating with Through Silicon Via | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2016-06-16 | — | — | US | claimed |
| CN-101421106-B | Copper electroplating of printing cylinders and copper deposition method | MACDERMID INC | 2010-08-11 | — | — | CN | claimed |
| CN-101421106-A | Copper electroplating of printing cylinders | MACDERMID INC (US) | 2009-04-29 | — | — | CN | claimed |
| CN-115734982-A | Dielectric film-forming composition | 富士胶片电子材料美国有限公司 | 2023-03-03 | — | — | CN | disclosed |
| CN-115074789-B | Circuit board blind hole rapid filling electrolytic copper plating solution and rapid filling method | 深圳市板明科技股份有限公司 | 2022-11-25 | — | — | CN | disclosed |
| CN-115210410-A | Method for producing metal-filled microstructure | 富士胶片株式会社 | 2022-10-18 | — | — | CN | disclosed |
| CN-115074789-A | Circuit board blind hole rapid filling electrolytic copper plating solution and rapid filling method | 深圳市板明科技股份有限公司 | 2022-09-20 | — | — | CN | disclosed |
| WO-2020057325-A1 | DETECTION METHOD AND SENSOR FOR L-CYSTEINE BASED ON 3,3'-DITHIOBIS(1-PROPANESULFONIC ACID)-MERCURY COMPOSITE FILM | 长沙理工大学 | 2020-03-26 | — | — | WO | disclosed |
| US-9856572-B2 | Additive for reducing voids after annealing of copper plating with through silicon via | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2018-01-02 | — | — | US | disclosed |
| US-20160190007-A1 | A METHOD FOR MICROVIA FILLING BY COPPER ELECTROPLATING WITH TSV TECHNOLOGY FOR 3D COPPER INTERCONNECTION AT HIGH ASPECT RATIO | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2016-06-30 | — | — | US | disclosed |
| US-20160168738-A1 | Additive for Reducing Voids after Annealing of Copper Plating with Through Silicon Via | SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. (CN) | 2016-06-16 | — | — | US | disclosed |
| CN-101421106-B | Copper electroplating of printing cylinders and copper deposition method | MACDERMID INC | 2010-08-11 | — | — | CN | disclosed |
| CN-101421106-A | Copper electroplating of printing cylinders | MACDERMID INC (US) | 2009-04-29 | — | — | CN | disclosed |