SCHEMBL1782415

SCHEMBL1782415

C=C[Si](C)(Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CA4 P22748 1/20 0.39
PAX8 Q06710 1/20 0.36
LTA4H P09960 3/20 0.36
TSHR P16473 2/20 0.36
ALDH1A1 P00352 1/20 0.33
THRB P10828 1/20 0.32
KCNA3 P22001 1/20 0.31
TGM2 P21980 1/20 0.31
MMP9 P14780 1/20 0.30
HDAC8 Q9BY41 1/20 0.30
TRPA1 O75762 1/20 0.30
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30
CA5A P35218 1/20 0.30
CA5B Q9Y2D0 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8150674 0.82 CA4 (0.39) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL22580518 0.82 CA4 (0.39) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL3336289 0.76 LTA4H (0.39) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL22563739 0.76 LTA4H (0.39) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL80762 0.76 LTA4H (0.39) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL8426084 0.74 CA4 (0.41) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL22654203 0.74 CA4 (0.41) CA4PAX8LTA4HTSHRALDH1A1
SCHEMBL13089302 0.74 KCNA3 (0.34) CA4LTA4HTSHRALDH1A1THRB
SCHEMBL13089178 0.74 KCNA3 (0.34) CA4LTA4HTSHRALDH1A1THRB
SCHEMBL14776711 0.73 CA4 (0.43) CA4PAX8LTA4HTSHRKCNA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
EP-3971229-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-23 EP disclosed
EP-3957678-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER Tokyo Ohka Kogyo Co., Ltd. (JP) 2022-02-23 EP disclosed
WO-2020235325-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER 東京応化工業株式会社 (JP) 2020-11-26 WO disclosed
US-20200362115-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA-BASED COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-19 US disclosed
WO-2020230828-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER 東京応化工業株式会社 2020-11-19 WO disclosed
EP-3257685-B1 LITHOGRAPHIC PRINTING ORIGINAL PLATE, METHOD FOR MANUFACTURING SAME, AND PRINTING METHOD USING SAME FUJIFILM CORP (JP) 2020-03-04 EP disclosed
US-10022998-B2 Planographic printing plate precursor, method of producing same, and printing method using same FUJIFILM CORPORATION (JP) 2018-07-17 US disclosed
EP-3257685-A1 LITHOGRAPHIC PRINTING ORIGINAL PLATE, METHOD FOR MANUFACTURING SAME, AND PRINTING METHOD USING SAME Fujifilm Corporation (JP) 2017-12-20 EP disclosed
US-20170320350-A1 PLANOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PRODUCING SAME, AND PRINTING METHOD USING SAME FUJIFILM CORPORATION (JP) 2017-11-09 US disclosed
US-8247590-B2 Method for preventing polymerization of unsaturated organosilicon compounds WACKER CHEMIE AG (DE) 2012-08-21 US disclosed
WO-2012091154-A1 METHOD OF PRODUCING A HYDROLYZABLE SILICON-CONTAINING COMPOUND WASEDA UNIVERSITY (JP) 2012-07-05 WO disclosed
US-20110118493-A1 METHOD FOR PREVENTING POLYMERIZATION OF UNSATURATED ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2011-05-19 US disclosed
US-7291567-B2 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2007-11-06 US disclosed
US-20060024980-A1 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2006-02-02 US disclosed
EP-1619226-A1 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR Corporation (JP) 2006-01-25 EP disclosed
US-6051665-A A FLUOROPOLYMER IS OBTAINED FROM THE MONOMER SELECTED FROM THE GROUP CONTAINING A FLUORO-OLEFIN, A FLUORO VINYL ETHER, A FLUORO (METH) ACRYLATE AND MIXTURE, ALSO CONTAIN HYDROLYZABLE SILYL GROUP, A SILOXY COMPOUND AND A CHELATE COMPLEX JSR CORPORATION (JP) 2000-04-18 US disclosed