SCHEMBL17856963

SCHEMBL17856963

CCn1c2ccc(C(=O)/C(=N/OC(=O)c3ccccc3)c3c(C)cc(C)cc3C)cc2c2cc(C(=O)c3ccccc3C)ccc21

nearest known ligand 0.41

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.39
KDM4E B2RXH2 5/20 0.39
HPGD P15428 5/20 0.39
LMNA P02545 4/20 0.39
KMT2A Q03164 3/20 0.39
SMN1; SMN2 Q16637 3/20 0.39
MEN1 O00255 2/20 0.39
HTT P42858 2/20 0.38
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
POLB P06746 1/20 0.37
CNR2 P34972 1/20 0.37
MAPT P10636 4/20 0.36
PTGER4 P35408 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17856964 0.92 KDM4E (0.41) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL17856967 0.91 ALDH1A1 (0.39) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL17856960 0.91 KDM4E (0.40) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL17856968 0.86 KMT2A (0.42) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL24394482 0.86 KDM4E (0.41) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL15499939 0.84 KDM4E (0.41) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL3209043 0.84 MAPT (0.47) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL12629353 0.84 MAPT (0.47) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL29824485 0.84 MAPT (0.47) ALDH1A1KDM4EHPGDLMNAKMT2A
SCHEMBL19632552 0.84 KDM4E (0.43) ALDH1A1KDM4EHPGDLMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed