SCHEMBL17866354

SCHEMBL17866354

O=C(O)c1[nH]nnc1-c1ccccc1O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HAO1 Q9UJM8 3/20 0.40
▸ L3MBTL1 Q9Y468 1/20 0.40
▸ IDO1 P14902 2/20 0.40
▸ MGAM O43451 1/20 0.40
▸ THRB P10828 1/20 0.40
▸ RAB9A P51151 1/20 0.40
▸ ALDH1A1 P00352 3/20 0.38
▸ HSD17B10 Q99714 2/20 0.38
▸ KDM4E B2RXH2 2/20 0.38
▸ ALPL P05186 1/20 0.38
▸ CA12 O43570 2/20 0.38
▸ CA1 P00915 2/20 0.38
▸ CA2 P00918 2/20 0.38
▸ CA7 P43166 2/20 0.38
▸ CA9 Q16790 2/20 0.38
▸ CA14 Q9ULX7 2/20 0.38
▸ HPGD P15428 2/20 0.38
▸ BCL2L1 Q07817 1/20 0.38
▸ DCUN1D1 Q96GG9 1/20 0.38
▸ ADORA2A P29274 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31172948 1.00 HAO1 (0.40) HAO1L3MBTL1IDO1MGAMTHRB
SCHEMBL29852207 0.82 HAO1 (0.42) HAO1RAB9AALDH1A1HSD17B10KDM4E
SCHEMBL23294662 0.82 HAO1 (0.42) HAO1RAB9AALDH1A1HSD17B10KDM4E
SCHEMBL23294571 0.82 HAO1 (0.41) HAO1RAB9AALDH1A1HSD17B10KDM4E
SCHEMBL15946998 0.79 KDM4E (0.46) HAO1IDO1RAB9AALDH1A1KDM4E
Hydrochloric Acid SCHEMBL3527570 0.77 KDM4E (0.44) HAO1IDO1RAB9AALDH1A1KDM4E
SCHEMBL23294477 0.76 MAP2K4 (0.45) HAO1IDO1RAB9AALDH1A1KDM4E
SCHEMBL23294375 0.76 MAP2K4 (0.45) HAO1IDO1RAB9AALDH1A1KDM4E
SCHEMBL23294634 0.74 KMO (0.46) HAO1ALPL
SCHEMBL23328966 0.73 MAP2K4 (0.41) HAO1ALPLCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3241075-B1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MAT USA INC (US) 2024-10-16 — — EP disclosed
CN-107850859-A Stripping composition for removing photoresist on semiconductor substrate 富士胶片电子材料美国有限公司 2018-03-27 — — CN disclosed
US-9914902-B2 Stripping compositions for removing photoresists from semiconductor substrates FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-03-13 — — US disclosed
EP-3241075-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FujiFilm Electronic Materials USA, Inc. (US) 2017-11-08 — — EP disclosed
US-20160186106-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-06-30 — — US disclosed
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