SCHEMBL17866360

SCHEMBL17866360

O=C(O)c1nc(=S)[nH][nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22382 0.52 ALDH1A1 (0.55)
Hydrochloric Acid SCHEMBL2032392 0.50 TSHR (0.36)
Potassium SCHEMBL30932480 0.50 TSHR (0.36)
SCHEMBL8460568 0.46
Oxalic Acid SCHEMBL8432824 0.46
Oxalic Acid SCHEMBL11805219 0.46 CA1 (0.57)
Oxalic Acid SCHEMBL776 0.46
Oxalic Acid SCHEMBL11213178 0.46 CA1 (0.57)
Oxalic Acid SCHEMBL736262 0.46
Oxalic Acid SCHEMBL11211823 0.46 CA1 (0.57)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3241075-B1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MAT USA INC (US) 2024-10-16 EP disclosed
US-9914902-B2 Stripping compositions for removing photoresists from semiconductor substrates FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-03-13 US disclosed
EP-3241075-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FujiFilm Electronic Materials USA, Inc. (US) 2017-11-08 EP disclosed
US-20160186106-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-06-30 US disclosed