SCHEMBL1787271

SCHEMBL1787271

CCC(C)(C)c1ccccc1OP(=O)(Oc1ccccc1C(C)(C)CC)Oc1ccccc1C(C)(C)CC

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 4/20 0.34
L3MBTL1 Q9Y468 2/20 0.34
MAPK1 P28482 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
NPC1 O15118 1/20 0.33
LMNA P02545 1/20 0.33
CASP3 P42574 1/20 0.33
RAB9A P51151 1/20 0.33
ATM Q13315 1/20 0.33
SENP8 Q96LD8 1/20 0.33
SENP7 Q9BQF6 1/20 0.33
SENP6 Q9GZR1 1/20 0.33
ALDH1A1 P00352 4/20 0.33
MEN1 O00255 3/20 0.33
KMT2A Q03164 3/20 0.33
NAMPT P43490 1/20 0.33
GAA P10253 2/20 0.33
PKM P14618 1/20 0.33
TSHR P16473 1/20 0.33
KDM4E B2RXH2 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29405705 1.00 NPSR1 (0.34) NPSR1L3MBTL1MAPK1SMN1; SMN2NPC1
SCHEMBL2719413 0.86 MEN1 (0.35) NPSR1L3MBTL1MEN1KMT2AXBP1
SCHEMBL27859933 0.86 INPPL1 (0.46) NPSR1L3MBTL1ALDH1A1MEN1KMT2A
SCHEMBL8473039 0.84 POLB (0.33) NPSR1NPC1ALDH1A1NAMPTGAA
SCHEMBL18114039 0.81 SRC (0.33) NPSR1SMN1; SMN2ALDH1A1NAMPTGAA
SCHEMBL18114066 0.81 KDM4E (0.35) NPSR1ATMALDH1A1MEN1KMT2A
SCHEMBL190944 0.81 TDP1 (0.45) NPSR1ATMALDH1A1NAMPTGAA
SCHEMBL29405225 0.81 TDP1 (0.45) NPSR1ATMALDH1A1NAMPTGAA
SCHEMBL2717054 0.80 MEN1 (0.43) NPSR1L3MBTL1LMNAALDH1A1MEN1
SCHEMBL1787834 0.78 MAPK1 (0.55) NPSR1MAPK1SMN1; SMN2NPC1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240339730-A1 ELECTROCHEMICAL DEVICE NINGDE AMPEREX TECHNOLOGY LIMITED (CN) 2024-10-10 US claimed
EP-4411963-A2 ELECTROCHEMICAL DEVICE Ningde Amperex Technology Ltd. (CN) 2024-08-07 EP claimed
US-12057602-B2 Electrochemical device NINGDE AMPEREX TECHNOLOGY LIMITED (CN) 2024-08-06 US claimed
EP-3966880-B1 ELECTROCHEMICAL DEVICE NINGDE AMPEREX TECHNOLOGY LTD (CN) 2024-07-31 EP claimed
US-20230198096-A1 ELECTROCHEMICAL DEVICE NINGDE AMPEREX TECHNOLOGY LIMITED (CN) 2023-06-22 US claimed
CN-112670666-B Electrochemical device 宁德新能源科技有限公司 2022-08-12 CN claimed
CN-112670666-A Electrochemical device 宁德新能源科技有限公司 2021-04-16 CN claimed
CN-110061176-B Electrochemical device 宁德新能源科技有限公司 2021-01-15 CN claimed
US-20240339730-A1 ELECTROCHEMICAL DEVICE NINGDE AMPEREX TECHNOLOGY LIMITED (CN) 2024-10-10 US disclosed
EP-4411963-A2 ELECTROCHEMICAL DEVICE Ningde Amperex Technology Ltd. (CN) 2024-08-07 EP disclosed
US-12057602-B2 Electrochemical device NINGDE AMPEREX TECHNOLOGY LIMITED (CN) 2024-08-06 US disclosed
EP-3966880-B1 ELECTROCHEMICAL DEVICE NINGDE AMPEREX TECHNOLOGY LTD (CN) 2024-07-31 EP disclosed
US-11637319-B2 Electrolytic solution and electrochemical device NINGDE AMPEREX TECHNOLOGY LIMITED (CN) 2023-04-25 US disclosed
CN-112670666-B Electrochemical device 宁德新能源科技有限公司 2022-08-12 CN disclosed
US-20110123871-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS-ELECTROLYTE BATTERY MITSUBISHI CHEMCIAL (JP) 2011-05-26 US disclosed
US-20100331463-A1 POLYARYLENE SULFIDE RESIN COMPOSITION, PRODUCTION METHOD THEREOF AND SURFACE MOUNT ELECTRONIC COMPONENT DIC CORPORATION (JP) 2010-12-30 US disclosed
EP-2249426-A1 NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROLYTE BATTERY Mitsubishi Chemical Corporation (JP) 2010-11-10 EP disclosed
EP-2236560-A1 POLY(ARYLENE SULFIDE) RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, AND SURFACE MOUNT ELECTRONIC COMPONENT DIC Corporation (JP) 2010-10-06 EP disclosed
US-7041718-B2 Polyacetal resin composition and moldings POLYPLASTICS CO., LTD. (JP) 2006-05-09 US disclosed
US-20050075429-A1 Polyacetal resin composition and moldings POLYPLASTICS CO. LTD. (JP) 2005-04-07 US disclosed