SCHEMBL1787834

SCHEMBL1787834

CCC(C)(C)c1ccc(OP(=O)(Oc2ccc(C(C)(C)CC)cc2C(C)(C)CC)Oc2ccc(C(C)(C)CC)cc2C(C)(C)CC)c(C(C)(C)CC)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 6/20 0.55
NPSR1 Q6W5P4 5/20 0.55
SMN1; SMN2 Q16637 5/20 0.55
MEN1 O00255 4/20 0.55
KMT2A Q03164 4/20 0.55
ALDH1A1 P00352 1/20 0.55
MAPT P10636 5/20 0.47
HTT P42858 3/20 0.47
UBE2N P61088 2/20 0.47
GLA P06280 1/20 0.47
MITF O75030 1/20 0.47
RAB9A P51151 4/20 0.43
RAD52 P43351 2/20 0.43
STAT3 P40763 1/20 0.43
RCE1 Q9Y256 1/20 0.43
APAF1 O14727 1/20 0.43
HSP90AA1 P07900 1/20 0.43
NOD2 Q9HC29 1/20 0.43
NPC1 O15118 3/20 0.41
LMNA P02545 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7952140 0.88 MAPK1 (0.56) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL8473986 0.81 MAPK1 (0.57) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL8655138 0.80 MAPK1 (0.56) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL6682773 0.79 MAPK1 (0.63) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL8470405 0.78 MAPK1 (0.67) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL10105923 0.78 MAPK1 (0.55) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL988255 0.78 MAPK1 (0.55) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL29405705 0.78 NPSR1 (0.34) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL1787271 0.78 NPSR1 (0.34) MAPK1NPSR1SMN1; SMN2MEN1KMT2A
SCHEMBL1953482 0.77 MAPK1 (0.62) MAPK1NPSR1SMN1; SMN2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2249426-B1 NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROLYTE BATTERY MITSUBISHI CHEM CORP (JP) 2019-07-10 EP disclosed
EP-2236560-B1 POLYARYLENE SULFIDE RESIN COMPOSITION, PRODUCTION METHOD THEREOF AND SURFACE MOUNT ELECTRONIC COMPONENT DAINIPPON INK & CHEMICALS (JP) 2017-03-01 EP disclosed
US-9083058-B2 Nonaqueous electrolytic solution and nonaqueous-electrolyte battery MITSUBISHI CHEMICAL CORPORATION (JP) 2015-07-14 US disclosed
US-8916298-B2 Nonaqueous electrolytic solution and nonaqueous-electrolyte battery MITSUBISHI CHEMICAL CORPORATION (JP) 2014-12-23 US disclosed
US-8889302-B2 Nonaqueous electrolytic solution and nonaqueous-electrolyte battery MITSUBISHI CHEMICAL CORPORATION (JP) 2014-11-18 US disclosed
US-8846254-B2 2014-09-30 US disclosed
US-20140134481-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS-ELECTROLYTE BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2014-05-15 US disclosed
US-20120308883-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS-ELECTROLYTE BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2012-12-06 US disclosed
US-20120219854-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS-ELECTROLYTE BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2012-08-30 US disclosed
US-8044126-B2 Polyarylene sulfide resin composition, production method thereof and surface mount electronic component DIC CORPORATION (JP) 2011-10-25 US disclosed
US-20110123871-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS-ELECTROLYTE BATTERY MITSUBISHI CHEMCIAL (JP) 2011-05-26 US disclosed
US-20100331463-A1 POLYARYLENE SULFIDE RESIN COMPOSITION, PRODUCTION METHOD THEREOF AND SURFACE MOUNT ELECTRONIC COMPONENT DIC CORPORATION (JP) 2010-12-30 US disclosed
EP-2249426-A1 NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROLYTE BATTERY Mitsubishi Chemical Corporation (JP) 2010-11-10 EP disclosed
EP-2236560-A1 POLY(ARYLENE SULFIDE) RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, AND SURFACE MOUNT ELECTRONIC COMPONENT DIC Corporation (JP) 2010-10-06 EP disclosed
US-7041718-B2 Polyacetal resin composition and moldings POLYPLASTICS CO., LTD. (JP) 2006-05-09 US disclosed
US-20050075429-A1 Polyacetal resin composition and moldings POLYPLASTICS CO. LTD. (JP) 2005-04-07 US disclosed
US-6231804-B1 USED FOR HOLLOW CONTAINERS, A FILM, A SHEET, A PIPE, FIBER AND MOLDING;A BLEND OF HIGH MOLECULAR WEIGHT POLYETHYLENE COPOLYMER,AN OLEFIN HOMO OR COPLYMER CHISSO CORPORATION (JP) 2001-05-15 US disclosed
EP-0972800-A1 MODIFIED OLEFIN (CO)POLYMER COMPOSITION, PROCESS FOR PREPARING THE SAME, AND MODIFIED OLEFIN (CO)POLYMER COMPOSITION MOLDING CHISSO CORPORATION (JP) 2000-01-19 EP disclosed