SCHEMBL1789561

SCHEMBL1789561

Nc1cc(C(F)(F)F)c(-c2c(C(F)(F)F)cc(N)cc2C(F)(F)F)c(C(F)(F)F)c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.54
GAA P10253 2/20 0.54
POLB P06746 2/20 0.54
GLA P06280 1/20 0.54
KIF11 P52732 2/20 0.40
ALDH1A1 P00352 6/20 0.39
MAPT P10636 2/20 0.39
MAPK1 P28482 1/20 0.37
TP53 P04637 1/20 0.36
CYP3A4 P08684 1/20 0.36
CA2 P00918 2/20 0.35
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA4 P22748 1/20 0.35
CA6 P23280 1/20 0.35
CA5A P35218 1/20 0.35
CA7 P43166 1/20 0.35
CA9 Q16790 1/20 0.35
CA14 Q9ULX7 1/20 0.35
CA5B Q9Y2D0 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16357060 0.86 TSHR (0.43) TSHRGAAPOLBGLAKIF11
SCHEMBL30568362 0.85 TSHR (0.46) TSHRGAAPOLBGLAKIF11
SCHEMBL13990210 0.83 TSHR (0.45) TSHRGAAPOLBGLAKIF11
SCHEMBL15801320 0.82 TSHR (0.42) TSHRGAAPOLBGLAKIF11
SCHEMBL11844970 0.82 GAA (0.54) TSHRGAAPOLBGLAKIF11
SCHEMBL13385893 0.81 KIF11 (0.55) TSHRGAAPOLBGLAKIF11
SCHEMBL392404 0.80 TSHR (0.52) TSHRGAAPOLBGLAKIF11
SCHEMBL13385850 0.79 TSHR (0.76) TSHRGAAPOLBGLAKIF11
SCHEMBL3115697 0.78 GAA (0.50) TSHRGAAPOLBGLAKIF11
SCHEMBL5511595 0.78 GAA (0.50) TSHRGAAPOLBGLAKIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119912689-A Resin, resin composition and cured film 华为技术有限公司 2025-05-02 CN claimed
CN-119798189-A Diamine monomer with epoxy structure, preparation method thereof and polyimide resin 比亚迪股份有限公司 2025-04-11 CN claimed
CN-118388398-A Diamine monomer, preparation method thereof, resin, solution thereof and cured film 深圳先进电子材料国际创新研究院 2024-07-26 CN claimed
CN-118047948-A Resin, preparation method thereof and resin composition 华为技术有限公司 2024-05-17 CN claimed
CN-117304037-A Diamine monomer, preparation method thereof, resin and application thereof 华为技术有限公司 2023-12-29 CN claimed
US-20250346020-A1 LAMINATE AND DISPLAY KANEKA CORPORATION (JP) 2025-11-13 US disclosed
US-20250320338-A1 TRANSPARENT FILM, HARD COAT FILM, AND DISPLAY KANEKA CORPORATION (JP) 2025-10-16 US disclosed
CN-119912689-A Resin, resin composition and cured film 华为技术有限公司 2025-05-02 CN disclosed
CN-119798189-A Diamine monomer with epoxy structure, preparation method thereof and polyimide resin 比亚迪股份有限公司 2025-04-11 CN disclosed
US-20250109264-A1 FILM, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE KANEKA CORPORATION (JP) 2025-04-03 US disclosed
US-20250075037-A1 POROUS POLYIMIDE HAVING HIGHLY UNIFORM NANO STRUCTURE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-03-06 US disclosed
US-12234323-B2 Transparent polyimide film and production method therefor KANEKA CORPORATION (JP) 2025-02-25 US disclosed
US-6890626-B1 Imide-benzoxazole polycondensate and process for producing the same PI R&D CO., LTD. (JP) 2005-05-10 US disclosed
EP-1123954-B1 COMPOSITION FOR POLYIMIDE ELECTRODEPOSITION AND METHOD OF FORMING PATTERNED POLYIMIDE FILM WITH THE SAME PI R & D CO LTD (JP) 2005-04-13 EP disclosed
US-20040197699-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-07 US disclosed
EP-1431822-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2004-06-23 EP disclosed
US-6630064-B1 Electro-depositing polyimide membranes which can be patterned by photolithography, which are excellent in heat resistance, insulation performance and in chemical resistance, photoacid generator, a positive-type photosensitive polyimide PI R&D CO., LTD. (JP) 2003-10-07 US disclosed
EP-1262509-A1 IMIDE-BENZOXAZOLE POLYCONDENSATE AND PROCESS FOR PRODUCING THE SAME PI R & D Co., Ltd. (JP) 2002-12-04 EP disclosed
EP-1209184-A1 PHOTOSENSITIVE LOW-PERMITTIVITY POLYIMIDE AND METHOD OF FORMING POSITIVE POLYIMIDE FILM PATTERN FROM THE SAME PI R & D Co., Ltd. (JP) 2002-05-29 EP disclosed
EP-1123954-A1 COMPOSITION FOR POLYIMIDE ELECTRODEPOSITION AND METHOD OF FORMING PATTERNED POLYIMIDE FILM WITH THE SAME PI R & D Co., Ltd. (JP) 2001-08-16 EP disclosed