SCHEMBL17995170

SCHEMBL17995170

NC(N)C(N)(N)C(N)N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22711075 0.74
SCHEMBL16055 0.71
SCHEMBL17995163 0.69 ALDH1A1 (0.32)
Ammonia Solution, Strong SCHEMBL10955204 0.67
SCHEMBL9329896 0.63
SCHEMBL9747004 0.63
SCHEMBL16268502 0.63
Hydrochloric Acid SCHEMBL3862442 0.60
SCHEMBL18351724 0.56
SCHEMBL525068 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3369778-B1 MOLDED ARTICLE COMPRISING RESIN COMPOSITION CONTAINING POLYAMIDE RESIN TORAY INDUSTRIES (JP) 2020-09-30 EP disclosed
US-20180312692-A1 MOLDED PRODUCT MADE FROM RESIN COMPOSITION INCLUDING POLYAMIDE RESIN TORAY INDUSTRIES, INC. (JP) 2018-11-01 US disclosed
EP-3059283-B1 POLYAMIDE RESIN COMPOSITION, MANUFACTURING METHOD, AND MOLDED ARTICLE TORAY INDUSTRIES (JP) 2018-10-10 EP disclosed
EP-3369778-A1 MOLDED ARTICLE COMPRISING RESIN COMPOSITION CONTAINING POLYAMIDE RESIN Toray Industries, Inc. (JP) 2018-09-05 EP disclosed
US-9873793-B2 Polyamide resin composition, method of manufacturing and molded product TORAY INDUSTRIES, INC. (JP) 2018-01-23 US disclosed
US-20160264778-A1 POLYAMIDE RESIN COMPOSITION, METHOD OF MANUFACTURING AND MOLDED PRODUCT TORAY INDUSTRIES, INC. (JP) 2016-09-15 US disclosed
EP-3059283-A1 POLYAMIDE RESIN COMPOSITION, MANUFACTURING METHOD, AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2016-08-24 EP disclosed