SCHEMBL1802227

SCHEMBL1802227

O=S(=O)(O)C(Cl)CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1479468 0.78
SCHEMBL18796367 0.77
SCHEMBL8126770 0.76
SCHEMBL1111713 0.76
Hydrochloric Acid SCHEMBL11522026 0.74 HDAC1 (0.39)
SCHEMBL11161292 0.74 CA1 (0.30)
SCHEMBL1858623 0.74 TP53 (0.36)
SCHEMBL8521185 0.72 TP53 (0.43)
SCHEMBL270921 0.71 THRB (0.32)
SCHEMBL973895 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2496659-A1 INJECTION FLUID AND ASSISTED PETROLEUM RECOVERY METHOD IFP Energies nouvelles (FR) 2012-09-12 EP claimed
WO-2011055038-A1 INJECTION FLUID AND ASSISTED PETROLEUM RECOVERY METHOD IFP Energies Nouvelles (FR) 2011-05-12 WO claimed
EP-0786021-B1 PROCESS FOR MAKING COPPER FOIL ELECTROCOPPER PROD LTD (US) 2000-01-12 EP claimed
EP-0632146-B1 Process for making electrodeposited copper foil using electrolyte solutions having controlled additions of chloride ions and inorganic impurities GOULD ELECTRONICS INC (US) 1998-07-01 EP claimed
US-5679232-A FORMING THIN WEB OF METAL FOIL, CUTTING, SHAPING ELECTROCOPPER PRODUCTS LIMITED (US) 1997-10-21 US claimed
EP-0786021-A4 1997-07-30 EP claimed
EP-0786021-A1 PROCESS FOR MAKING COPPER FOIL ElectroCopper Products Limited (US) 1997-07-30 EP claimed
EP-0485588-B1 ELECTRODEPOSITED COPPER FOIL AND PROCESS FOR MAKING SAME USING ELECTROLYTE SOLUTIONS HAVING LOW CHLORIDE ION CONCENTRATIONS GOULD ELECTRONICS INC (US) 1997-04-09 EP claimed
EP-0739430-A4 PROCESS FOR MAKING COPPER WIRE ELECTROCOPPER PROD LTD (US) 1997-01-15 EP claimed
EP-0739430-A1 PROCESS FOR MAKING COPPER WIRE ElectroCopper Products Limited (US) 1996-10-30 EP claimed
US-5516408-A BELOW THE MELTING POINT, LEACHING, SOLVENT EXTRACTION, ELECTRODEPOSITION MAGMA COPPER COMPANY (US) 1996-05-14 US claimed
WO-1996013624-A1 PROCESS FOR MAKING COPPER WIRE MAGMA COPPER COMPANY (US) 1996-05-09 WO claimed
US-5403465-A Comprising a matte-side raw roughened layer of copper or copper oxide and at least one metallic metal or alloy barrier layer; tensile strength, elongation, heat resistance GOULD INC. (US) 1995-04-04 US claimed
EP-0632146-A1 Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives GOULD ELECTRONICS INC. (US) 1995-01-04 EP claimed
US-5366612-A Process for making copper foil MAGMA COPPER COMPANY (US) 1994-11-22 US claimed
WO-1994024338-A1 PROCESS FOR MAKING COPPER FOIL MAGMA COPPER COMPANY (US) 1994-10-27 WO claimed
JP-8245984-A None JP disclosed
CN-109072061-B Zwitterionic surfactants suitable for enhanced oil recovery 罗地亚经营管理公司 2021-10-08 CN disclosed
EP-0040346-A1 Process for refining a raw condensation product from aminoalkylalkanol amines and fatty acids, and as soon as required for the subsequent recovery of amphotensides with higher stability Henkel Kommanditgesellschaft auf Aktien (DE) 1981-11-25 EP disclosed
US-4296234-A CONSISTING OF CROSSLINKED, GELLED, IONIC STARCHES LEVER BROTHERS COMPANY (US) 1981-10-20 US disclosed