⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL544958 | 1.00 | — | — | |
| SCHEMBL8700654 | 0.87 | — | — | |
| SCHEMBL29254371 | 0.87 | — | — | |
| SCHEMBL27752876 | 0.87 | — | — | |
| SCHEMBL15168920 | 0.87 | — | — | |
| SCHEMBL3417125 | 0.87 | — | — | |
| SCHEMBL29158131 | 0.87 | — | — | |
| SCHEMBL6281291 | 0.87 | — | — | |
| SCHEMBL31668846 | 0.87 | — | — | |
| SCHEMBL27717155 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 975 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12032295-B2 | Optical lithography system and method of using the same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-07-09 | — | — | US | disclosed |
| US-12021064-B2 | Semiconductor devices and methods of manufacture | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-06-25 | — | — | US | disclosed |
| US-12021066-B2 | Buffer layer(s) on a stacked structure having a via | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-06-25 | — | — | US | disclosed |
| US-12021047-B2 | Semiconductor packages having a die, an encapsulant, and a redistribution structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-06-25 | — | — | US | disclosed |
| US-12014979-B2 | Methods of forming semiconductor packages | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-06-18 | — | — | US | disclosed |
| US-20240194730-A1 | Interconnect Layout for Semiconductor Device | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2024-06-13 | — | — | US | disclosed |
| US-20240194611-A1 | SEMICONDUCTOR PACKAGE AND METHOD | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2024-06-13 | — | — | US | disclosed |
| US-12009345-B2 | 3D package structure and methods of forming same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-06-11 | — | — | US | disclosed |
| US-12002767-B2 | Integrated circuit package and method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-06-04 | — | — | US | disclosed |
| US-20240178091-A1 | Integrated Circuit Package and Method | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2024-05-30 | — | — | US | disclosed |
| CN-102054790-A | Semiconductor device and method for manufacturing the same | TTAIWAN SEMICONDUCTOR MFG CO LTD | 2011-05-11 | — | — | CN | disclosed |
| US-20110101520-A1 | Semiconductor Die Contact Structure and Method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2011-05-05 | — | — | US | disclosed |
| CN-101859762-A | Semiconductor device and method for manufacturing the same | TAIWAN SEMICONDUCTOR MFG | 2010-10-13 | — | — | CN | disclosed |
| US-20100252934-A1 | Three-Dimensional Semiconductor Architecture | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2010-10-07 | — | — | US | disclosed |
| US-20100237502-A1 | Barrier for Through-Silicon Via | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2010-09-23 | — | — | US | disclosed |
| US-20100187687-A1 | Underbump Metallization Structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2010-07-29 | — | — | US | disclosed |
| US-20100144118-A1 | Method for Stacking Semiconductor Dies | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2010-06-10 | — | — | US | disclosed |
| US-20100047963-A1 | Through Silicon Via Bonding Structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2010-02-25 | — | — | US | disclosed |
| CN-101656197-A | Through silicon via bonding structure | TAIWAN SEMICONDUCTOR MFG | 2010-02-24 | — | — | CN | disclosed |
| US-20100032843-A1 | Through Silicon Via Layout | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2010-02-11 | — | — | US | disclosed |