SCHEMBL1806446

SCHEMBL1806446

C=C(C)C(=O)OCCC(O[SiH3])C(Cl)Cl

nearest known ligand 0.44

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.44
TSHR P16473 3/20 0.43
ALDH1A1 P00352 2/20 0.35
POLB P06746 1/20 0.34
APEX1 P27695 1/20 0.34
HTT P42858 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1224520 0.90 TSHR (0.49) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL8752630 0.80 THRB (0.48) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL6151322 0.80 THRB (0.52) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL709903 0.78 THRB (0.50) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL3916030 0.77 THRB (0.68) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL27733083 0.76 TSHR (0.55) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL8899373 0.74 TSHR (0.54) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL8900503 0.74 TSHR (0.50) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL29144385 0.74 TSHR (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL5008670 0.74 THRB (0.46) THRBTSHRALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8728624-B2 Fixing material comprising silane compound polymer and photonic device sealed body LINTEC CORPORATION (JP) 2014-05-20 US disclosed
US-20130096253-A1 FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY LINTEC CORPORATION (JP) 2013-04-18 US disclosed
US-20110124812-A1 FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY LINTEC CORPORATION (JP) 2011-05-26 US disclosed