SCHEMBL1817186

SCHEMBL1817186

CC1=CCCCC1(C(=O)O)C(=O)O

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
CCR2 P41597 5/20 0.37
AKR1C1 Q04828 1/20 0.31
FFAR3 O14843 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL541537 0.87 CCR2 (0.33) CCR2
SCHEMBL5314340 0.78 CCR2 (0.40) CCR2AKR1C1FFAR3
SCHEMBL1615146 0.77 CCR2 (0.47) CCR2AKR1C1
SCHEMBL30060328 0.73 CCR2 (0.39) CCR2
SCHEMBL16694992 0.71 CCR2 (0.33) CCR2
SCHEMBL29067360 0.67
SCHEMBL1496194 0.66
SCHEMBL16391178 0.65 CCR2 (0.38) CCR2AKR1C1FFAR3
SCHEMBL10933220 0.65 FFAR3 (0.34) CCR2FFAR3
SCHEMBL761120 0.65 FFAR3 (0.30) FFAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024068483-A1 LED-CURABLE OFFSET INKS CONTAINING ALUMINUM ADDITIVES SUN CHEMICAL B.V. (NL) 2024-04-04 WO claimed
US-4600521-A Electron-beam reactive magnetic coating composition for magnetic recording media NIPPON ZEON CO., LTD. (JP) 1986-07-15 US claimed
JP-2003404-A None JP disclosed
WO-2024068483-A1 LED-CURABLE OFFSET INKS CONTAINING ALUMINUM ADDITIVES SUN CHEMICAL B.V. (NL) 2024-04-04 WO disclosed
CN-105461921-B Polyimide resin composition, adhesive compound, paint base composition, laminated body and the copper foil with resin 荒川化学工业株式会社 2019-05-10 CN disclosed
US-9349714-B2 Method of manufacturing semiconductor device, block stacked body, and sequential stacked body SUMITOMO BAKELITE CO., LTD. (JP) 2016-05-24 US disclosed
CN-102906162-B Curable composition, method for producing epoxy resin-inorganic polymer composite material using same, and epoxy resin-inorganic polymer composite material KANSAI UNIVERSITY 2014-12-10 CN disclosed
US-20140183758-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, AND SEQUENTIAL STACKED BODY SUMITOMO BAKELITE CO., LTD. (JP) 2014-07-03 US disclosed
CN-102906162-A Curable composition, method for producing epoxy resin-inorganic polymer composite material using same, and epoxy resin-inorganic polymer composite material KANSAI UNIVERSITY 2013-01-30 CN disclosed
US-7989130-B2 Electrostatic latent image developing toner, manufacturing method for electrostatic latent image developing toner, electrostatic latent image developing developer, and image forming method FUJI XEROX CO., LTD. (JP) 2011-08-02 US disclosed
US-20110100690-A1 ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME FUJITSU LIMITED (JP) 2011-05-05 US disclosed
US-20070196740-A1 LITHIUM SECONDARY BATTERY CONTAINING CARBOXYLIC ANHYDRIDE ORGANIC COMPOUND IN ELECTROLYTE HITACHI, LTD. (JP) 2007-08-23 US disclosed
US-20070020541-A1 Electrostatic latent image developing toner, manufacturing method for electrostatic latent image developing toner, electrostatic latent image developing developer, and image forming method FUJI XEROX CO., LTD. (JP) 2007-01-25 US disclosed
US-20050001014-A1 Method of mounting electronic part and flux-fill FUJITSU LIMITED (JP) 2005-01-06 US disclosed
US-6214931-B1 ACRYLIC ESTER COPOLYMER UCB, S.A. (BE) 2001-04-10 US disclosed
US-5898043-A CONSISTS OF A FILM FORMING RESIN AND A CROSSLINKING AGENT CAPABLE OF FORMING CROSSLINKED RESIN POWDER HAS A SPECIFIC VOLUME-AVERAGE PARTICLE DIAMETER AND SHAPE FACTOR 100.5 TO 160 NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1999-04-27 US disclosed
EP-0751192-A1 POWDER PAINT, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PAINTING USING THE PAINT NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1997-01-02 EP disclosed
EP-0540751-A1 STEROID COMPOUND COMBINED WITH POLYSACCHARIDE Eisai Co., Ltd. (JP) 1993-05-12 EP disclosed
JP-H023404-A PREPARATION OF AQUEOUS DISPERSION OF COPOLYMER MITSUBISHI YUKA BADISCHE CO LTD 1990-01-09 JP disclosed
US-4600521-A Electron-beam reactive magnetic coating composition for magnetic recording media NIPPON ZEON CO., LTD. (JP) 1986-07-15 US disclosed