Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYR | P14679 | 3/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.53 |
| ▸ | TP53 | P04637 | 1/20 | 0.53 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.53 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.53 |
| ▸ | MAPT | P10636 | 1/20 | 0.53 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.53 |
| ▸ | TSHR | P16473 | 1/20 | 0.53 |
| ▸ | HTT | P42858 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.53 |
| ▸ | APP | P05067 | 6/20 | 0.51 |
| ▸ | IAPP | P10997 | 2/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.45 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.45 |
| ▸ | LCK | P06239 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1823738 | 1.00 | TYR (0.53) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL1823336 | 0.98 | TYR (0.50) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL1823337 | 0.98 | TYR (0.50) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL1824725 | 0.94 | TYR (0.55) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL1824727 | 0.94 | TYR (0.55) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL1824859 | 0.92 | TYR (0.53) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL1824857 | 0.92 | TYR (0.53) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL11503809 | 0.87 | TYR (0.50) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL11760568 | 0.87 | TYR (0.50) | TYRMEN1TP53CYP3A4ALOX5 | |
| SCHEMBL685783 | 0.87 | TYR (0.50) | TYRMEN1TP53CYP3A4ALOX5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | claimed |
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | disclosed |
| EP-2119737-B1 | Electronic packaging | EVONIK DEGUSSA GMBH (DE) | 2011-05-04 | — | — | EP | disclosed |
| EP-2119737-A1 | Electronic packaging | Evonik Degussa GmbH (DE) | 2009-11-18 | — | — | EP | disclosed |
| EP-0869140-B1 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-6255409-B1 | EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS | SUMITOMO CHEMICAL CO., LTD. (JP) | 2001-07-03 | — | — | US | disclosed |
| US-6190786-B1 | BIS(GLYCIDYLOXY)STILBENE RESINS | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2001-02-20 | — | — | US | disclosed |
| EP-0943639-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-09-22 | — | — | EP | disclosed |
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | disclosed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | disclosed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | disclosed |
| US-5854370-A | Epoxy resin stilbenes and process for producing the same by photoisomerization | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0869140-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5705596-A | STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-01-06 | — | — | US | disclosed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | disclosed |