SCHEMBL1825593

SCHEMBL1825593

C1OC1COC(OCC1CO1)OCC1CO1

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.46
ALDH1A1 P00352 10/20 0.44
MAPK1 P28482 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.39
TDP1 Q9NUW8 3/20 0.38
TP53 P04637 4/20 0.37
CYP3A4 P08684 2/20 0.37
HIF1A Q16665 2/20 0.37
GLA P06280 1/20 0.34
MAPT P10636 2/20 0.32
HPGD P15428 2/20 0.32
MEN1 O00255 1/20 0.32
CYP1A2 P05177 1/20 0.32
KMT2A Q03164 1/20 0.32
PPARG P37231 1/20 0.32
LMNA P02545 1/20 0.32
GAA P10253 1/20 0.32
PKM P14618 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3458576 0.78 ALDH1A1 (0.46) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL3975311 0.78
SCHEMBL635723 0.78 ALDH1A1 (0.46) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL4542782 0.78 ALDH1A1 (0.43) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL2556581 0.78
SCHEMBL25210172 0.78 TSHR (0.42) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL39030 0.78
SCHEMBL1261540 0.74
SCHEMBL1892342 0.74
SCHEMBL23175183 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023032943-A1 HEAT-CURABLE COMPOSITION 豊田合成株式会社 2023-03-09 WO disclosed
US-20220289922-A1 FIBER-REINFORCED EPOXY RESIN COMPOSITE SHEET, FIBER-REINFORCED COMPOSITE PLATE AND FIBER-REINFORCED MOLDED ARTICLE, AND METHOD FOR PRODUCING SAME FUKUVI CHEMICAL INDUSTRY CO., LTD. (JP) 2022-09-15 US disclosed
US-20210403701-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2021-12-30 US disclosed
US-11161975-B2 Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 2021-11-02 US disclosed
EP-2920243-B1 MATERIAL FOR FILLING A COMPOSITE STRUCTURE STRUCTIL (FR) 2020-10-14 EP disclosed
US-10513577-B2 Epoxy resin composition, molded article, prepreg, fiber-reinforced composite material and structure MITSUBISHI CHEMICAL CORPORATION (JP) 2019-12-24 US disclosed
US-20190330464-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2019-10-31 US disclosed
EP-3309190-B1 EPOXY RESIN COMPOSITION, MOLDED ARTICLE, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL AND STRUCTURE MITSUBISHI CHEM CORP (JP) 2019-08-07 EP disclosed
US-20180155489-A1 EPOXY RESIN COMPOSITION, MOLDED ARTICLE, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL AND STRUCTURE MITSUBISHI CHEMICAL CORPORATION (JP) 2018-06-07 US disclosed
EP-3309190-A1 EPOXY RESIN COMPOSITION, MOLDED ARTICLE, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL AND STRUCTURE Mitsubishi Chemical Corporation (JP) 2018-04-18 EP disclosed
US-6399199-B1 EPOXY RESIN, CURING AGENT AND MATRIX RESIN TORAY INDUSTRIES INC. (JP) 2002-06-04 US disclosed
US-20020009581-A1 Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same KISHI HAJIME (JP) 2002-01-24 US disclosed
EP-1162228-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2001-12-12 EP disclosed
US-6228474-B1 Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same TORAY INDUSTRIES, INC. (JP) 2001-05-08 US disclosed
US-6063839-A FIBERS AND EPOXY RESINS WITH CURING TORAY INDUSTRIES, INC. (JP) 2000-05-16 US disclosed
US-6046257-A PREPREG EXCELLENT IN TACKINESS AND DRAPABILITY; FIBER REINFORCED COMPOSITES TORAY INDUSTRIES, INC. (JP) 2000-04-04 US disclosed
EP-0825222-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, YARN PREPREG, AND PROCESS AND APPARATUS FOR PREPARING THE SAME TORAY INDUSTRIES, INC. (JP) 1998-02-25 EP disclosed
US-5709715-A Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same OWENS-CORNING FIBERGLAS TECHNOLOGY INC. (US) 1998-01-20 US disclosed
EP-0742266-A2 Epoxy resin compostions for fiber-reinforced composite materials, prepregs and fiber-reinforced composite materials TORAY INDUSTRIES, INC. (JP) 1996-11-13 EP disclosed
EP-0723994-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 1996-07-31 EP disclosed