⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL526333 | 0.82 | — | — | |
| SCHEMBL149819 | 0.82 | — | — | |
| SCHEMBL6370966 | 0.81 | — | — | |
| SCHEMBL1828351 | 0.76 | — | — | |
| SCHEMBL6371716 | 0.76 | — | — | |
| SCHEMBL24197449 | 0.73 | — | — | |
| SCHEMBL2821952 | 0.69 | — | — | |
| SCHEMBL735965 | 0.69 | — | — | |
| SCHEMBL1942226 | 0.67 | — | — | |
| SCHEMBL450190 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102585704-A | Chemical mechanical polishing slurry composition and method for producing semiconductor device using the same | SOULBRAIN CO LTD | 2012-07-18 | — | — | CN | claimed |
| CN-102159662-A | Barrier slurry for low-k dielectrics | CABOT MICROELECTRONICS CORP | 2011-08-17 | — | — | CN | claimed |
| EP-0679945-B1 | Processing of a silver halide photgraphic with a peroxide bleach composition | EASTMAN KODAK CO (US) | 1998-08-19 | — | — | EP | claimed |
| WO-2024070066-A1 | PROTUSION-AND-RECESS STRUCTURE AND METHOD FOR MANUFACTURING PROTRUSION-AND-RECESS STRUCTURE | 株式会社村田製作所 | 2024-04-04 | — | — | WO | disclosed |
| CN-110678489-B | Polyvinyl alcohol resin, dispersant, and dispersant for suspension polymerization | 三菱化学株式会社 | 2023-03-14 | — | — | CN | disclosed |
| CN-114375230-A | Soil modification method | 电化株式会社 | 2022-04-19 | — | — | CN | disclosed |
| CN-114340373-A | Method for dispersing resin emulsion | 电化株式会社 | 2022-04-12 | — | — | CN | disclosed |
| WO-2021075104-A1 | METHOD FOR SPRAYING RESIN EMULSION | デンカ株式会社 | 2021-04-22 | — | — | WO | disclosed |
| CN-108291144-B | Soil erosion preventive agent having good freezing dissolution stability | 电化株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-110678489-A | Polyvinyl alcohol resin, dispersant, and dispersant for suspension polymerization | 三菱化学株式会社 | 2020-01-10 | — | — | CN | disclosed |
| EP-2842998-B1 | RESIN COMPOSITION AND USE THEREFOR | NIPPON SYNTHETIC CHEM IND CO LTD (JP) | 2017-03-08 | — | — | EP | disclosed |
| CN-101563368-A | Hybrid polymer and preparation method | BRIDGESTONE CORP (JP) | 2009-10-21 | — | — | CN | disclosed |
| US-20090253880-A1 | DISPERSION STABILIZER FOR SUSPENSION POLYMERIZATION OF VINYL-BASED COMPOUND | THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| EP-2058342-A1 | DISPERSION STABILIZER FOR VINYL COMPOUND SUSPENSION POLYMERIZATION | The Nippon Synthetic Chemical Industry Co., Ltd. (JP) | 2009-05-13 | — | — | EP | disclosed |
| EP-2033991-A1 | WATER BASED EMULSION AND USE THEREOF | The Nippon Synthetic Chemical Industry Co., Ltd. (JP) | 2009-03-11 | — | — | EP | disclosed |
| US-7491766-B2 | Aqueous emulsion and use thereof | THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. (JP) | 2009-02-17 | — | — | US | disclosed |
| EP-1571161-B1 | Aqueous emulsion and use thereof | NIPPON SYNTHETIC CHEM IND (JP) | 2007-05-16 | — | — | EP | disclosed |
| US-20050197441-A1 | Aqueous emulsion and use thereof | THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. | 2005-09-08 | — | — | US | disclosed |
| EP-1571161-A1 | Aqueous emulsion and use thereof | Nippon Synthetic Chemical Industry Co., Ltd (JP) | 2005-09-07 | — | — | EP | disclosed |
| EP-0970969-B1 | PROCESS FOR PRODUCING FINE POLYMER PARTICLES | KAO CORP (JP) | 2003-05-14 | — | — | EP | disclosed |