SCHEMBL1833396

SCHEMBL1833396

[Cu].[O].[S]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL53064 0.82
SCHEMBL30948398 0.82
SCHEMBL29383752 0.82
SCHEMBL1003380 0.82
SCHEMBL3966144 0.82
SCHEMBL980035 0.82
SCHEMBL8510895 0.67
Charcoal, Activated SCHEMBL7730654 0.67
SCHEMBL11324719 0.67
SCHEMBL7534492 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2321843-A2 COPPER LAYER PROCESSING Micron Technology, Inc. (US) 2011-05-18 EP claimed
WO-2010027406-A2 COPPER LAYER PROCESSING MICRON TECHNOLOGY, INC. (US) 2010-03-11 WO claimed
US-20100051577-A1 COPPER LAYER PROCESSING MICRON TECHNOLOGY, INC. (US) 2010-03-04 US claimed
CN-102144282-A Copper layer treatment MICRON TECHNOLOGY INC 2011-08-03 CN disclosed
EP-2321843-A2 COPPER LAYER PROCESSING Micron Technology, Inc. (US) 2011-05-18 EP disclosed
WO-2010027406-A2 COPPER LAYER PROCESSING MICRON TECHNOLOGY, INC. (US) 2010-03-11 WO disclosed
US-20100051577-A1 COPPER LAYER PROCESSING MICRON TECHNOLOGY, INC. (US) 2010-03-04 US disclosed