⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30694960 | 0.82 | — | — | |
| SCHEMBL30007864 | 0.82 | — | — | |
| SCHEMBL31668872 | 0.82 | — | — | |
| Charcoal, Activated SCHEMBL7730654 | 0.82 | — | — | |
| SCHEMBL1833396 | 0.82 | — | — | |
| SCHEMBL30130874 | 0.82 | — | — | |
| SCHEMBL31274719 | 0.82 | — | — | |
| SCHEMBL30917326 | 0.82 | — | — | |
| SCHEMBL31689361 | 0.82 | — | — | |
| SCHEMBL30708930 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2085 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-224258677-U | Anti-seepage copper oxygen gun sleeve for electric arc furnace smelting | 山东鲁银新材料科技有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-122007197-A | Cooling mechanism based on low oxygen copper bar molding | 安徽盛源鑫祥新材料科技有限公司 | 2026-05-12 | — | — | CN | claimed |
| CN-120046273-A | Casting molding process for low-oxygen copper | 常州同泰高导新材料有限公司 | 2025-05-27 | — | — | CN | claimed |
| CN-115319042-B | Low oxygen copper pole forming device | 安徽楚江高新电材有限公司 | 2025-04-25 | — | — | CN | claimed |
| WO-2025082123-A1 | INSULATED WIRE, MANUFACTURING METHOD THEREFOR AND PRODUCTION APPARATUS | 宁波金田电磁科技有限公司 | 2025-04-24 | — | — | WO | claimed |
| CN-222778602-U | Low oxygen copper pole continuous casting tandem rolling device | 江西省越兴铜业有限公司 | 2025-04-22 | — | — | CN | claimed |
| CN-119660780-A | Method for modulating yttrium barium copper oxide by oxygen vacancy | 北京邮电大学 | 2025-03-21 | — | — | CN | claimed |
| CN-119595533-A | Low-oxygen copper wire elongation tensile test equipment and method | 常州同泰高导新材料有限公司 | 2025-03-11 | — | — | CN | claimed |
| CN-119581134-A | Preparation process of eight hundred-volt high-voltage-resistant electromagnetic wire | 铜陵精达漆包线有限公司 | 2025-03-07 | — | — | CN | claimed |
| CN-119555141-A | Alternative cable selection method | 华能广东汕头海上风电有限责任公司 | 2025-03-04 | — | — | CN | claimed |
| US-5990008-A | Semiconductor device with pure copper wirings and method of manufacturing a semiconductor device with pure copper wirings | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-11-23 | — | — | US | claimed |
| EP-0472180-B1 | Highly dispersed cuprous compositions | AIR PROD & CHEM (US) | 1996-02-14 | — | — | EP | claimed |
| CN-1064941-A | Oxygen in Oxygen-Free Copper standard substance and preparation method | COPPER PROCESSING FACTORY BEIF (CN) | 1992-09-30 | — | — | CN | claimed |
| EP-0259772-B1 | APPARATUS AND METHOD FOR MANUFACTURING COPPER-BASE ALLOY | MITSUBISHI MATERIALS CORPORATION (JP) | 1992-08-05 | — | — | EP | claimed |
| US-5126310-A | Selective adsorbent for carbon monoxide or ethylene | AIR PRODUCTS AND CHEMICALS, INC. (US) | 1992-06-30 | — | — | US | claimed |
| EP-0472180-A2 | Highly dispersed cuprous compositions | AIR PRODUCTS AND CHEMICALS, INC. (US) | 1992-02-26 | — | — | EP | claimed |
| CN-1055160-A | Copper adding technology with oxygen for copper washing procedure of chemical fertilizer plant | GUO LI (CN) | 1991-10-09 | — | — | CN | claimed |
| US-4981514-A | CONTINUOUS | MITSUBISHI KINZOKU KABUSHIKI KAISHA (JP) | 1991-01-01 | — | — | US | claimed |
| EP-0259772-A2 | Apparatus and method for manufacturing copper-base alloy | MITSUBISHI MATERIALS CORPORATION (JP) | 1988-03-16 | — | — | EP | claimed |
| US-4563383-A | Direct bond copper ceramic substrate for electronic applications | GENERAL ELECTRIC COMPANY (US) | 1986-01-07 | — | — | US | claimed |