⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL8008657 | 0.91 | — | — | |
| SCHEMBL36723 | 0.89 | — | — | |
| SCHEMBL11432344 | 0.80 | — | — | |
| Bromide SCHEMBL5961728 | 0.80 | — | — | |
| Bromide SCHEMBL11261850 | 0.80 | — | — | |
| SCHEMBL11057441 | 0.80 | — | — | |
| Water SCHEMBL9443623 | 0.80 | — | — | |
| Ammonia Solution, Strong SCHEMBL8334514 | 0.80 | — | — | |
| SCHEMBL16280458 | 0.80 | — | — | |
| Hydrochloric Acid SCHEMBL9316579 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 662 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4396249-A1 | TWO-COMPONENT STRUCTURAL ADHESIVE | DDP Specialty Electronic Materials US, LLC (US) | 2024-07-10 | — | — | EP | claimed |
| EP-4388028-A1 | A HEAT-CURABLE-REACTION-RESIN MIXTURE | Huntsman Advanced Materials Licensing (Switzerland) GmbH (CH) | 2024-06-26 | — | — | EP | claimed |
| CN-117940477-A | Heat-curable reaction resin mixture | 亨斯迈先进材料许可(瑞士)有限公司 | 2024-04-26 | — | — | CN | claimed |
| CN-117897425-A | Two-component structural adhesive | DDP特种电子材料美国有限责任公司 | 2024-04-16 | — | — | CN | claimed |
| WO-2024075480-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER | 三菱瓦斯化学株式会社 | 2024-04-11 | — | — | WO | claimed |
| CN-117810280-A | High-reflectivity black grid glass solar cell backboard and preparation method and application thereof | 苏州赛伍应用技术股份有限公司 | 2024-04-02 | — | — | CN | claimed |
| CN-115305022-B | Epoxy resin electronic pouring sealant and preparation method and application thereof | 华烁科技股份有限公司 | 2024-03-26 | — | — | CN | claimed |
| CN-112119105-B | Accelerator composition for curing polyfunctional isocyanates using epoxy resins | 亨斯迈先进材料许可(瑞士)有限公司 | 2024-03-19 | — | — | CN | claimed |
| CN-115785772-B | Phenolic epoxy primer for oil well pipe and preparation method and application thereof | 海隆石油产品技术服务（上海）有限公司 | 2023-12-01 | — | — | CN | claimed |
| US-20230279276-A1 | BONDING DISSIMILAR MATERIALS USING RADIO FREQUENCY WAVE CURING | DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) | 2023-09-07 | — | — | US | claimed |
| US-4663072-A | HIGH MELTING POINT ANHYDRIDE LIQUID ANHYDRIDE, AND LOW MELTING POINT ANHYDRIDE | FORD MOTOR COMPANY (US) | 1987-05-05 | — | — | US | claimed |
| US-4659779-A | Solid solution of amine and polymerized phenol as epoxy resin cure accelerator | CIBA-GEIGY CORPORATION (US) | 1987-04-21 | — | — | US | claimed |
| EP-0186326-A2 | Acid anhydride mixtures in paste form useful for curing epoxy resins and a dual catalyst system therefor | FORD MOTOR COMPANY LIMITED (GB) | 1986-07-02 | — | — | EP | claimed |
| EP-0110968-A1 | EPOXY COATING POWDERS WITH WRINKLE FINISHES | THE POLYMER CORPORATION (US) | 1984-06-20 | — | — | EP | claimed |
| US-4427740-A | COVERING A CONDUCTIVE MEMBER WITH POROUS CYCLOALIPHATIC EPOXY RESIN, SILICON CARBIDE AND CURING AGENT, VACUUM PRESSURE IMPREGNATION WITH RESIN, AND HEATING | WESTINGHOUSE ELECTRIC CORP. (US) | 1984-01-24 | — | — | US | claimed |
| WO-1983004195-A1 | EPOXY COATING POWDERS WITH WRINKLE FINISHES | THE POLYMER CORPORATION (US) | 1983-12-08 | — | — | WO | claimed |
| EP-0058149-A4 | EPOXY COATING POWDERS. | POLYMER CORP (US) | 1982-12-20 | — | — | EP | claimed |
| EP-0058149-A1 | EPOXY COATING POWDERS | THE POLYMER CORPORATION (US) | 1982-08-25 | — | — | EP | claimed |
| WO-1982000651-A1 | EPOXY COATING POWDERS | HOUSENICK J | 1982-03-04 | — | — | WO | claimed |
| US-4247594-A | CURING A MIXTURE OF COPPER FLAKES, THE DIGLYCIDYL ETHER OF BISPHENOL A, AND A CURING AGENT AND THEN APPLYING AN ELECTRICAL POTENTIAL | MARSHALL & PIKE ENTERPRISES INC. (US) | 1981-01-27 | — | — | US | claimed |