SCHEMBL1834629

SCHEMBL1834629

C=C(C)C(=O)OCC(O)CO.C=C(C)C(=O)OCCOCCOCCOCCOC(=O)C(=C)C

nearest known ligand 0.56

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.56
TSHR P16473 6/20 0.50
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
KDM4E B2RXH2 1/20 0.38
DUSP3 P51452 1/20 0.38
LMNA P02545 1/20 0.38
USP2 O75604 1/20 0.35
ALDH1A1 P00352 5/20 0.34
POLB P06746 1/20 0.33
APEX1 P27695 1/20 0.33
HTT P42858 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
DGKA P23743 1/20 0.33
TP53 P04637 2/20 0.32
HIF1A Q16665 2/20 0.32
HSD17B10 Q99714 1/20 0.32
FAAH O00519 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29261094 0.95 TSHR (0.55) THRBTSHRMEN1KMT2AKDM4E
SCHEMBL5907719 0.92 THRB (0.58) THRBTSHRMEN1KMT2AKDM4E
Glycerin SCHEMBL674116 0.91 THRB (0.61) THRBTSHRMEN1KMT2AKDM4E
SCHEMBL29375450 0.89 TSHR (0.61) THRBTSHRMEN1KMT2AKDM4E
SCHEMBL25707 0.89 TSHR (0.61) THRBTSHRMEN1KMT2AKDM4E
SCHEMBL16863053 0.89 TSHR (0.61) THRBTSHRMEN1KMT2AKDM4E
SCHEMBL5484572 0.88 TSHR (0.52) THRBTSHRMEN1KMT2AKDM4E
Methane SCHEMBL28897391 0.88 TSHR (0.59) THRBTSHRMEN1KMT2AKDM4E
Glycerin SCHEMBL28100194 0.88 TSHR (0.59) THRBTSHRMEN1KMT2AKDM4E
Ethylene SCHEMBL27572484 0.88 TSHR (0.59) THRBTSHRMEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1834975-B1 Thermosetting poly(phenylene ether) SABIC INNOVATIVE PLASTICS IP (NL) 2011-05-11 EP claimed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US claimed
US-6352782-B1 None US disclosed
EP-1834975-B1 Thermosetting poly(phenylene ether) SABIC INNOVATIVE PLASTICS IP (NL) 2011-05-11 EP disclosed
EP-2316870-A1 Poly(phenylene ether) - polyvinyl thermosetting resin SABIC Innovative Plastics IP B.V. (NL) 2011-05-04 EP disclosed
EP-1834975-A1 Poly(Phenylene ether) - Polyvinyl thermosetting resin General Electric Company (US) 2007-09-19 EP disclosed
EP-1265946-B1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GEN ELECTRIC (US) 2007-03-28 EP disclosed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
EP-1265946-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2002-12-18 EP disclosed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US disclosed
US-6352782-B2 REACTING A POLYPHENYLENE ETHER CONTAINING HYDROXY GROUPS THAT HAVE BEEN CAPPED WITH A COMPOUND CONTAINING ETHYLENICALLY UNSATURATION WITH A CURABLE UNSATURATED MONOMER CAPABLE OF REACTING WITH ETHYLENICALLY UNSATURATED COMPOUND GENERAL ELECTRIC COMPANY 2002-03-05 US disclosed
US-20010053450-A1 POLY (PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2001-12-20 US disclosed
WO-2001040354-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2001-06-07 WO disclosed