⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22076974 | 0.75 | — | — | |
| SCHEMBL15951371 | 0.67 | — | — | |
| SCHEMBL3820595 | 0.62 | — | — | |
| SCHEMBL5206262 | 0.57 | — | — | |
| SCHEMBL22698345 | 0.47 | — | — | |
| SCHEMBL21374382 | 0.45 | — | — | |
| Benzene SCHEMBL27585527 | 0.43 | — | — | |
| SCHEMBL12160498 | 0.42 | — | — | |
| SCHEMBL179721 | 0.42 | — | — | |
| SCHEMBL1332288 | 0.42 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 588 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12624262-B2 | High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers | DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) | 2026-05-12 | — | — | US | claimed |
| EP-4396249-A1 | TWO-COMPONENT STRUCTURAL ADHESIVE | DDP Specialty Electronic Materials US, LLC (US) | 2024-07-10 | — | — | EP | claimed |
| CN-117897425-A | Two-component structural adhesive | DDP特种电子材料美国有限责任公司 | 2024-04-16 | — | — | CN | claimed |
| US-20240110085-A1 | HIGH MODULUS, TOUGHENED ONE-COMPONENT EPOXY STRUCTURAL ADHESIVES WITH HIGH ASPECT RATIO FILLERS | DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) | 2024-04-04 | — | — | US | claimed |
| CN-117511127-A | Epoxy resin composition and preparation method and application thereof | 广东风华高新科技股份有限公司 | 2024-02-06 | — | — | CN | claimed |
| US-20230279276-A1 | BONDING DISSIMILAR MATERIALS USING RADIO FREQUENCY WAVE CURING | DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) | 2023-09-07 | — | — | US | claimed |
| CN-116438270-A | Bonding dissimilar materials using radio frequency wave curing | DDP特种电子材料美国有限责任公司 | 2023-07-14 | — | — | CN | claimed |
| EP-4189029-A1 | BONDING DISSIMILAR MATERIALS USING RADIO FREQUENCY WAVE CURING | DDP Specialty Electronic Materials US, LLC (US) | 2023-06-07 | — | — | EP | claimed |
| WO-2023033919-A1 | TWO-COMPONENT STRUCTURAL ADHESIVE | DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) | 2023-03-09 | — | — | WO | claimed |
| WO-2022031409-A1 | BONDING DISSIMILAR MATERIALS USING RADIO FREQUENCY WAVE CURING | DDP SPECIALTY ELECTRONIC MATERIAL US, LLC (US) | 2022-02-10 | — | — | WO | claimed |
| US-20210009871-A1 | HIGH MODULUS, TOUGHENED ONE-COMPONENT EPOXY STRUCTURAL ADHESIVES WITH HIGH ASPECT RATIO FILLERS | DOW EUROPE GMBH (CH) | 2021-01-14 | — | — | US | claimed |
| EP-3347394-B1 | HIGH MODULUS, TOUGHENED ONE-COMPONENT EPOXY STRUCTURAL ADHESIVES WITH HIGH ASPECT RATIO FILLERS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2020-03-11 | — | — | EP | claimed |
| EP-1456286-B1 | EXPANDABLE EPOXY RESIN-BASED SYSTEMS MODIFIED WITH THERMOPLASTIC POLYMERS | HENKEL AG & CO KGAA (DE) | 2012-06-13 | — | — | EP | claimed |
| US-20040266899-A1 | Expandable epoxy resin-based systems modified with thermoplastic polymers | HENKEL KGAA (DE) | 2004-12-30 | — | — | US | claimed |
| EP-1456286-A1 | EXPANDABLE EPOXY RESIN-BASED SYSTEMS MODIFIED WITH THERMOPLASTIC POLYMERS | Henkel Teroson GmbH (DE) | 2004-09-15 | — | — | EP | claimed |
| WO-2003054069-A1 | EXPANDABLE EPOXY RESIN-BASED SYSTEMS MODIFIED WITH THERMOPLASTIC POLYMERS | HENKEL TEROSON GMBH (DE) | 2003-07-03 | — | — | WO | claimed |
| US-12624262-B2 | High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers | DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) | 2026-05-12 | — | — | US | disclosed |
| US-20260028510-A1 | METHOD FOR MANUFACTURING LAMINATE | KANEKA CORPORATION (JP) | 2026-01-29 | — | — | US | disclosed |
| EP-0824574-A1 | TWO-COMPONENT ADHESIVE/SEALING MASS WITH HIGH INITIAL ADHESIVENESS | Henkel Teroson GmbH (DE) | 1998-02-25 | — | — | EP | disclosed |
| WO-1996035761-A1 | TWO-COMPONENT ADHESIVE/SEALING MASS WITH HIGH INITIAL ADHESIVENESS | HENKEL TEROSON GMBH (DE) | 1996-11-14 | — | — | WO | disclosed |