Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 11/20 | 0.41 |
| ▸ | FAAH | O00519 | 2/20 | 0.39 |
| ▸ | SHBG | P04278 | 1/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.36 |
| ▸ | CCR6 | P51684 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 3/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | HPGD | P15428 | 2/20 | 0.33 |
| ▸ | HTT | P42858 | 2/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.33 |
| ▸ | GMNN | O75496 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | THPO | P40225 | 1/20 | 0.32 |
| ▸ | BLM | P54132 | 1/20 | 0.32 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.32 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.32 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29386487 | 1.00 | MGLL (0.41) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| SCHEMBL29649706 | 1.00 | MGLL (0.41) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| SCHEMBL29306520 | 0.98 | MGLL (0.40) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| SCHEMBL23514267 | 0.94 | MGLL (0.37) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| SCHEMBL28357264 | 0.91 | MGLL (0.46) | MGLLFAAHHSP90AA1CCR6ALDH1A1 | |
| SCHEMBL10036482 | 0.91 | MGLL (0.35) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| SCHEMBL24753876 | 0.91 | MGLL (0.35) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| Cyclopentene SCHEMBL29114359 | 0.90 | MGLL (0.34) | MGLLFAAHSHBGHSP90AA1CCR6 | |
| SCHEMBL184980 | 0.89 | MGLL (0.46) | MGLLFAAHHSP90AA1CCR6ALDH1A1 | |
| SCHEMBL27054308 | 0.89 | MGLL (0.46) | MGLLFAAHSHBGHSP90AA1CCR6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2131 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116063838-B | Maleimide pre-polymerized resin composition | 台光电子材料股份有限公司 | 2025-06-24 | — | — | CN | claimed |
| WO-2025123873-A1 | MODIFIED BISMALEIMIDE PREPOLYMER, PREPARATION METHOD THEREFOR AND USE THEREOF, AND RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF | 广东盈骅新材料科技有限公司 | 2025-06-19 | — | — | WO | claimed |
| WO-2025123875-A1 | RESIN COMPOSITION, PREPREG AND PREPARATION METHOD THEREFOR, AND LAMINATE AND PREPARATION METHOD THEREFOR | 广东盈骅新材料科技有限公司 | 2025-06-19 | — | — | WO | claimed |
| CN-120158248-A | Preparation method of adhesive with high adhesive property | 深圳市泰景科技有限公司 | 2025-06-17 | — | — | CN | claimed |
| CN-119978704-A | Thermosetting resin and heat-resistant resin composition comprising same | 联茂(无锡)电子科技有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-119912378-A | Preparation method of bis (3-ethyl-5-methyl-4-maleimidophenyl) methane | 天津科技大学 | 2025-05-02 | — | — | CN | claimed |
| CN-119775175-A | Allyl compound, preparation method thereof, bismaleimide resin composition and application thereof | 广东盈骅新材料科技有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119775702-A | Bismaleimide resin composition and application thereof | 广东盈骅新材料科技有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119775773-A | Resin composition and preparation method thereof, prepreg, laminated board and printed circuit board | 广东盈骅新材料科技有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119751870-A | Modified maleimide prepolymer, resin composition, prepreg and application thereof | 广东盈骅新材料科技有限公司 | 2025-04-04 | — | — | CN | claimed |
| EP-2141198-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | claimed |
| US-7514486-B2 | Vibration damping rubber composition | TOKAI RUBBER INDUSTRIES, LTD. (JP) | 2009-04-07 | — | — | US | claimed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | claimed |
| EP-1273609-B1 | RESIN COMPOUND FOR FORMING INTERLAYER INSULATING LAYER OF PRINTED WIRING BOARD, RESIN SHEET AND COPPER FOIL WITH RESIN FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM | MITSUI MINING & SMELTING CO (JP) | 2006-08-09 | — | — | EP | claimed |
| US-6780906-B2 | HAVING INSULATOR LAYER FORMED BY EXTRUSION-COATING AND CROSS-LINKING A CROSS-LINKABLE RESIN COMPOSITION WHICH CONTAINS A POLYOLEFIN BLENDED WITH BISMALEIMIDE COMPOUND | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2004-08-24 | — | — | US | claimed |
| US-6716530-B2 | FREE OF HALOGEN ELEMENTS, FLAME RETARDANCY, WATER RESISTANCE, HEAT RESISTANCE, PEELING STRENGTH | MITSUI MINING & SMELTING CO., LTD. (JP) | 2004-04-06 | — | — | US | claimed |
| EP-1304705-A1 | INSULATED POWER CABLE | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2003-04-23 | — | — | EP | claimed |
| EP-1273609-A1 | RESIN COMPOUND FOR FORMING INTERLAYER INSULATING LAYER OF PRINTED WIRING BOARD, RESIN SHEET AND COPPER FOIL WITH RESIN FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM | Mitsui Mining & Smelting Co., Ltd. (JP) | 2003-01-08 | — | — | EP | claimed |
| US-20020177638-A1 | Insulated electric power cable | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2002-11-28 | — | — | US | claimed |
| US-20020106516-A1 | Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulating layer using the resin compound, and copper-clad laminate using them | MITSUI MINING & SMELTING CO., LTD. | 2002-08-08 | — | — | US | claimed |