⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20243927 | 0.86 | — | — | |
| SCHEMBL18508055 | 0.84 | — | — | |
| SCHEMBL24477216 | 0.83 | — | — | |
| SCHEMBL6933473 | 0.81 | — | — | |
| SCHEMBL19485439 | 0.81 | — | — | |
| SCHEMBL18508042 | 0.79 | PLA2G1B (0.33) | — | |
| SCHEMBL18502222 | 0.78 | — | — | |
| SCHEMBL18508041 | 0.76 | — | — | |
| SCHEMBL18508046 | 0.75 | PRKCA (0.30) | — | |
| SCHEMBL10136491 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9994593-B2 | Copper compound, starting material for forming thin film, and method for manufacturing thin film | ADEKA CORPORATION (JP) | 2018-06-12 | — | — | US | disclosed |
| US-20170044188-A1 | COPPER COMPOUND, STARTING MATERIAL FOR FORMING THIN FILM, AND METHOD FOR MANUFACTURING THIN FILM | ADEKA CORPORATION (JP) | 2017-02-16 | — | — | US | disclosed |