SCHEMBL18536

SCHEMBL18536

CC/C=C(\Cl)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6537398 1.00
SCHEMBL465939 1.00
SCHEMBL14085305 0.80
SCHEMBL8373766 0.80
SCHEMBL23105063 0.80
SCHEMBL4612446 0.79
SCHEMBL4612448 0.79
SCHEMBL19622597 0.78 ALDH1A1 (0.35)
SCHEMBL11838843 0.78 TSHR (0.33)
SCHEMBL11418750 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 707 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240092954-A1 POLYMER THIN FILM FOR CAPTURING AND RELEASING NUCLEIC ACID WITH HIGH EFFICIENCY AND METHOD FOR EXTRACTING NUCLEIC ACID USING THE SAME KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2024-03-21 US claimed
EP-1287047-B1 PHOTO-POLYMERS AND USE THEREOF TERAHERTZ PHOTONICS LTD (GB) 2008-08-13 EP claimed
EP-4105271-B1 POLYAMIDE COMPOSITIONS ENVALIOR DEUTSCHLAND GMBH (DE) 2026-05-20 EP disclosed
EP-4522686-B1 CREEP-RESISTANT POLYESTER COMPOSITIONS ENVALIOR DEUTSCHLAND GMBH (DE) 2026-05-06 EP disclosed
EP-4314139-B1 POLYAMIDE COMPOSITIONS ENVALIOR DEUTSCHLAND GMBH (DE) 2026-04-08 EP disclosed
EP-4314144-B1 POLYAMIDE COMPOSITIONS ENVALIOR DEUTSCHLAND GMBH (DE) 2026-04-08 EP disclosed
EP-3868817-B1 HIGH VOLUME COMPONENTS ENVALIOR DEUTSCHLAND GMBH (DE) 2026-03-25 EP disclosed
EP-4650444-A1 NUCLEIC ACID EXTRACTION VESSEL PROVIDED WITH POSITIVELY CHARGED POLYMER THIN FILM, AND SINGLE-POT NUCLEIC ACID DETECTION METHOD USING CHARGE TRANSFER POLYPLEX Korea Advanced Institute of Science and Technology (KR) 2025-11-19 EP disclosed
EP-2924069-B2 POLYAMIDE COMPOSITIONS ENVALIOR DEUTSCHLAND GMBH (DE) 2025-06-25 EP disclosed
EP-4345136-B1 ELECTRONIC COMPONENT CONTAINING POLYCARBONATE MATERIAL WITH HIGH TRACK RESISTANCE COVESTRO DEUTSCHLAND AG (DE) 2025-06-11 EP disclosed
EP-4562076-A1 MINERAL-FILLED POLYCARBONATE BLEND MOULDING COMPOSITION HAVING A LOW BPA CONTENT, AND METHOD FOR PREPARING SAME Covestro Deutschland AG (DE) 2025-06-04 EP disclosed
EP-0050262-A1 Thermoplastic polyester moulding masses BAYER AG (DE) 1982-04-28 EP disclosed
EP-0042091-A1 Vinyl chloride polymers having impact strength BAYER AG (DE) 1981-12-23 EP disclosed
US-4294905-A DIAZO COMPOUNDS, OLEOPHILIC AND STORAGE STABLE FUJI PHOTO FILM CO., LTD. (JP) 1981-10-13 US disclosed
EP-0034748-A2 Impact resistant polymers with particular resistance to atmospheric conditions BAYER AG (DE) 1981-09-02 EP disclosed
EP-0033081-A1 Anionic copolymers containing polyvalent metal cations and their use in photographic materials Agfa-Gevaert AG (DE) 1981-08-05 EP disclosed
US-4065428-A Polymethylmethacrylate based molding compositions MONSANTO COMPANY (US) 1977-12-27 US disclosed
US-4041017-A Reactive light-sensitive high polymer compound containing furyl pentadienic ester groups and insolubilized by action of heat, light or electron beams FUJI PHOTO FILM CO., LTD. (JA) 1977-08-09 US disclosed
US-3933773-A Thermoplastic elastomeric copolymers and terpolymers of tetrafluoroethylene and propylene and method of making the same THIOKOL CORPORATION (US) 1976-01-20 US disclosed
US-3931248-A Reactive high polymer compound FUJI PHOTO FILM CO., LTD. (JA) 1976-01-06 US disclosed