Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.58 |
| ▸ | MAPT | P10636 | 5/20 | 0.58 |
| ▸ | RAB9A | P51151 | 4/20 | 0.58 |
| ▸ | NPC1 | O15118 | 3/20 | 0.58 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.58 |
| ▸ | HPGD | P15428 | 1/20 | 0.58 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.50 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.47 |
| ▸ | POLB | P06746 | 2/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.47 |
| ▸ | TSHR | P16473 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 2/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.43 |
| ▸ | MITF | O75030 | 1/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.43 |
| ▸ | GFER | P55789 | 1/20 | 0.43 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.43 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.43 |
| ▸ | MAOA | P21397 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28959032 | 1.00 | ALDH1A1 (0.58) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL9082044 | 0.98 | ALDH1A1 (0.55) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL1854909 | 0.95 | ALDH1A1 (0.53) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL26604996 | 0.92 | ALDH1A1 (0.52) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL25920604 | 0.92 | ALDH1A1 (0.52) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL2999316 | 0.90 | ALDH1A1 (0.47) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL9084915 | 0.87 | ALDH1A1 (0.46) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL26228778 | 0.87 | TEAD4 (0.55) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL26605022 | 0.87 | TEAD4 (0.55) | ALDH1A1MAPTRAB9ANPC1MAPK1 | |
| SCHEMBL6935311 | 0.86 | MAOB (0.51) | ALDH1A1MAPTRAB9ANPC1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 193 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117241942-B | Laminate body | 东洋纺株式会社 | 2026-05-19 | — | — | CN | disclosed |
| US-12479194-B2 | Laminate | TOYOBO CO., LTD. (JP) | 2025-11-25 | — | — | US | disclosed |
| US-12472732-B2 | Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device | TOYOBO CO., LTD. (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12391813-B2 | Layered body including inorganic substrate and polyamic acid cured product | TOYOBO CO., LTD. (JP) | 2025-08-19 | — | — | US | disclosed |
| CN-115551713-B | Laminate comprising transparent high heat resistant film | 东洋纺株式会社 | 2025-03-21 | — | — | CN | disclosed |
| US-20250019508-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2025-01-16 | — | — | US | disclosed |
| CN-115697575-B | Resin film and method for producing same | 东洋纺株式会社 | 2025-01-14 | — | — | CN | disclosed |
| WO-2024262187-A1 | RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN FILM | 東洋紡株式会社 | 2024-12-26 | — | — | WO | disclosed |
| US-12172409-B2 | Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method | TOYOBO CO., LTD. (JP) | 2024-12-24 | — | — | US | disclosed |
| CN-119072395-A | Laminate body | 东洋纺株式会社 | 2024-12-03 | — | — | CN | disclosed |
| US-5554765-A | HEAT RESISTANCE | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-09-10 | — | — | US | disclosed |
| US-5506291-A | FORMED BY REACTING ONE OR MORE DIAMINES WITH PYROMLLITIC ACID OR BIPHENYLTETRACARBOXYLIC ACID/3,3',4,4'-/ AND ENDCAPPED BY ANHYDRIDE OR AROMATIC MONOAMINE; USED FOR ELECTRONICS, AIRCRAFT, AND ELECTRICAL APPLIANCES | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-04-09 | — | — | US | disclosed |
| EP-0523240-B1 | BISIMIDE COMPOUNDS, POLYIMIDE RESIN COMPOSITION PREPARED THEREFROM, AND CARBON FIBER-REINFORCED POLYIMIDE RESIN COMPOSITION | MITSUI TOATSU CHEMICALS (JP) | 1996-03-20 | — | — | EP | disclosed |
| US-5494996-A | MELT PROCESSABILITY, HEAT AND AGING RESISTANCE | MITSUI TOATSU CHEMICALS INC. (JP) | 1996-02-27 | — | — | US | disclosed |
| US-5457154-A | Melt processability | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-10-10 | — | — | US | disclosed |
| EP-0661347-A1 | Polyimide resin composition having excellent fatigue resistance and injection molded article of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-07-05 | — | — | EP | disclosed |
| US-5406124-A | Thermoplastic polyimides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-04-11 | — | — | US | disclosed |
| EP-0636661-A1 | Polyimide resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-02-01 | — | — | EP | disclosed |
| EP-0605112-A2 | Insulating adhesive tape, and lead frame and semiconductor device employing the tape | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1994-07-06 | — | — | EP | disclosed |
| EP-0523240-A1 | BISIMIDE COMPOUNDS, POLYIMIDE RESIN COMPOSITION PREPARED THEREFROM, AND CARBON FIBER-REINFORCED POLYIMIDE RESIN COMPOSITION | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-01-20 | — | — | EP | disclosed |