Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 1/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.52 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.52 |
| ▸ | PBRM1 | Q86U86 | 1/20 | 0.49 |
| ▸ | STS | P08842 | 3/20 | 0.48 |
| ▸ | TTR | P02766 | 2/20 | 0.48 |
| ▸ | SRD5A2 | P31213 | 2/20 | 0.47 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.47 |
| ▸ | F10 | P00742 | 1/20 | 0.46 |
| ▸ | PARP10 | Q53GL7 | 2/20 | 0.45 |
| ▸ | POLB | P06746 | 1/20 | 0.44 |
| ▸ | TNKS | O95271 | 1/20 | 0.44 |
| ▸ | PARP15 | Q460N3 | 1/20 | 0.44 |
| ▸ | PARP14 | Q460N5 | 1/20 | 0.44 |
| ▸ | TNKS2 | Q9H2K2 | 1/20 | 0.44 |
| ▸ | PARP2 | Q9UGN5 | 1/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3645145 | 0.95 | SRD5A2 (0.53) | ATMTDP1L3MBTL1PBRM1STS | |
| SCHEMBL31343926 | 0.95 | SRD5A2 (0.51) | L3MBTL1PBRM1STSTTRSRD5A2 | |
| SCHEMBL1855981 | 0.95 | SRD5A2 (0.51) | L3MBTL1PBRM1STSTTRSRD5A2 | |
| SCHEMBL1852465 | 0.94 | SRD5A2 (0.54) | ATMTDP1L3MBTL1PBRM1STS | |
| SCHEMBL1860771 | 0.93 | PBRM1 (0.61) | ATMTDP1L3MBTL1PBRM1STS | |
| SCHEMBL29363065 | 0.93 | PBRM1 (0.61) | ATMTDP1L3MBTL1PBRM1STS | |
| SCHEMBL1856308 | 0.89 | SRD5A2 (0.50) | ATMTDP1L3MBTL1PBRM1STS | |
| SCHEMBL1855090 | 0.89 | HTT (0.53) | L3MBTL1TTRSRD5A2PARP10MAPK1 | |
| SCHEMBL30168224 | 0.89 | SRD5A2 (0.50) | ATMTDP1L3MBTL1PBRM1STS | |
| SCHEMBL29364451 | 0.88 | L3MBTL1 (0.54) | ATMTDP1L3MBTL1PBRM1STS |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 171 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6040418-A | FLUORINATED POLYMIDES COMPRISING UNITS OF 2,2',5,5',6,6'-HEXAFLUOROBIPHENYL-3,3',4,4'-TETRACARBOXYLIC DIANHYDRIDE AND AROMATIC DIAMINE | UBE INDUSTRIES, LTD. (JP) | 2000-03-21 | — | — | US | claimed |
| CN-117241942-B | Laminate body | 东洋纺株式会社 | 2026-05-19 | — | — | CN | disclosed |
| US-12479194-B2 | Laminate | TOYOBO CO., LTD. (JP) | 2025-11-25 | — | — | US | disclosed |
| US-12472732-B2 | Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device | TOYOBO CO., LTD. (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12391813-B2 | Layered body including inorganic substrate and polyamic acid cured product | TOYOBO CO., LTD. (JP) | 2025-08-19 | — | — | US | disclosed |
| CN-115551713-B | Laminate comprising transparent high heat resistant film | 东洋纺株式会社 | 2025-03-21 | — | — | CN | disclosed |
| WO-2025047667-A1 | SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL | 東洋紡株式会社 | 2025-03-06 | — | — | WO | disclosed |
| US-20250019508-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2025-01-16 | — | — | US | disclosed |
| CN-115697575-B | Resin film and method for producing same | 东洋纺株式会社 | 2025-01-14 | — | — | CN | disclosed |
| WO-2024262187-A1 | RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN FILM | 東洋紡株式会社 | 2024-12-26 | — | — | WO | disclosed |
| US-5631377-A | LONG-CHAIN AROMATIC DIAMINE MONOMER; MELT PROCESSABILITY, HEAT RESISTANCE | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-05-20 | — | — | US | disclosed |
| EP-0751168-A1 | Linear polyamic acid, linear polyimide and thermoset polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1997-01-02 | — | — | EP | disclosed |
| US-5508377-A | IMPROVED PROCESSABILITY, HEAT RESISTANCE; ELECTRONICS, STRUCTURAL MATERIALS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-04-16 | — | — | US | disclosed |
| US-5484880-A | HEAT RESISTANT POLYMERS FOR APPLIANCES AND INJECTION MOLDED ARTICLES OR FILMS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-01-16 | — | — | US | disclosed |
| US-5480965-A | BASED ON A NOVEL DIAMINO COMPOUND DERIVED FROM BENZOPHENONE STRUCTURE; FIBER REINFORCEMENT | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-01-02 | — | — | US | disclosed |
| US-5470943-A | Fibers formed by injection molding of polyimides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-11-28 | — | — | US | disclosed |
| EP-0662489-A1 | Polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-07-12 | — | — | EP | disclosed |
| EP-0659801-A1 | Polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-06-28 | — | — | EP | disclosed |
| EP-0659802-A1 | Polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-06-28 | — | — | EP | disclosed |
| EP-0639621-A2 | Polyimide-based resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-02-22 | — | — | EP | disclosed |