Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Phenolsulphonic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS1 | P23219 | 1/20 | 0.52 |
| ▸ | PKLR | P30613 | 4/20 | 0.48 |
| ▸ | DUSP5 | Q16690 | 1/20 | 0.44 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.44 |
| ▸ | CDK2 | P24941 | 1/20 | 0.42 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.42 |
| ▸ | PGAM1 | P18669 | 2/20 | 0.42 |
| ▸ | CA2 | P00918 | 3/20 | 0.41 |
| ▸ | CA4 | P22748 | 3/20 | 0.41 |
| ▸ | POLB | P06746 | 2/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.41 |
| ▸ | CA12 | O43570 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | MAPT | P10636 | 2/20 | 0.41 |
| ▸ | HPGD | P15428 | 2/20 | 0.41 |
| ▸ | CA5A | P35218 | 2/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.41 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenolsulphonic Acid SCHEMBL359607 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL237346 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL2967983 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL3176513 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL158699 | 0.95 | PKLR (0.53) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL11593234 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL5404273 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL1394635 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL20534105 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 | |
| Phenolsulphonic Acid SCHEMBL6619287 | 0.95 | PTGS1 (0.52) | PTGS1PKLRDUSP5NR4A1CDK2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0893514-B1 | Tin-silver alloy plating solution and method of plating with said plating solution | NAGANO PREFECTURE (JP) | 2003-04-02 | — | — | EP | claimed |
| US-5902472-A | FOR ELECTRODEPOSITION OF A TIN-SILVER ALLOY WITH A HIGH CURRENT EFFICIENCY AND WITHOUT USING A CYANIDE MATERIAL, SAID PLATING SOLUTION COMPRISING A TIN COMPOUND, A SILVER COMPOUND, A PYROPHOSPHORIC ACID AND AN IODIC COMPOUND | NAGANOKEN AND SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) | 1999-05-11 | — | — | US | claimed |
| EP-0893514-A2 | Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution | Naganoken (JP) | 1999-01-27 | — | — | EP | claimed |
| EP-0818563-A1 | AQUEOUS SOLUTION FOR FORMING METAL COMPLEXES, TIN-SILVER ALLOY PLATING BATH, AND PROCESS FOR PRODUCING PLATED OBJECT USING THE PLATING BATH | Naganoken (JP) | 1998-01-14 | — | — | EP | claimed |
| CN-117737716-A | Plating method for silver sintering connection, plating film, substrate for power module, semiconductor element, and semiconductor device | 上村工业株式会社 | 2024-03-22 | — | — | CN | disclosed |
| US-11920255-B2 | Composite plated product and method for producing same | DOWA METALTECH CO., LTD. (JP) | 2024-03-05 | — | — | US | disclosed |
| CN-114144544-A | Composite plated article and method for producing the same | 同和金属技术有限公司 | 2022-03-04 | — | — | CN | disclosed |
| US-11225726-B2 | Composite plated product and method for producing same | DOWA METALTECH CO., LTD. (JP) | 2022-01-18 | — | — | US | disclosed |
| US-11208730-B2 | Composite plated product and method for producing same | DOWA METALTECH CO., LTD. (JP) | 2021-12-28 | — | — | US | disclosed |
| CN-111705340-A | Composite plated article and method of making same | 同和金属技术有限公司 | 2020-09-25 | — | — | CN | disclosed |
| US-20200299852-A1 | COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME | DOWA METALTECH CO., LTD. (JP) | 2020-09-24 | — | — | US | disclosed |
| US-20200232110-A1 | COMPOSITE PLATED PRODUCT AND METHOD FOR PRODUCING SAME | DOWA METALTECH CO., LTD. (JP) | 2020-07-23 | — | — | US | disclosed |
| CN-100533785-C | Plating method | ROHM & HAAS ELECT MAT (US) | 2009-08-26 | — | — | CN | disclosed |
| US-20080035489-A1 | Plating process | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| CN-101123281-A | Plating method | ROHM & HAAS ELECT MAT (US) | 2008-02-13 | — | — | CN | disclosed |
| EP-1865563-A2 | Light assisted electro plating process | Rohm and Haas Electronic Materials, L.L.C. (US) | 2007-12-12 | — | — | EP | disclosed |
| EP-0893514-B1 | Tin-silver alloy plating solution and method of plating with said plating solution | NAGANO PREFECTURE (JP) | 2003-04-02 | — | — | EP | disclosed |
| US-5902472-A | FOR ELECTRODEPOSITION OF A TIN-SILVER ALLOY WITH A HIGH CURRENT EFFICIENCY AND WITHOUT USING A CYANIDE MATERIAL, SAID PLATING SOLUTION COMPRISING A TIN COMPOUND, A SILVER COMPOUND, A PYROPHOSPHORIC ACID AND AN IODIC COMPOUND | NAGANOKEN AND SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) | 1999-05-11 | — | — | US | disclosed |
| EP-0893514-A2 | Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution | Naganoken (JP) | 1999-01-27 | — | — | EP | disclosed |
| EP-0818563-A1 | AQUEOUS SOLUTION FOR FORMING METAL COMPLEXES, TIN-SILVER ALLOY PLATING BATH, AND PROCESS FOR PRODUCING PLATED OBJECT USING THE PLATING BATH | Naganoken (JP) | 1998-01-14 | — | — | EP | disclosed |