SCHEMBL1860943

SCHEMBL1860943

[Al+3].[O-2].[O-2].[O-2].[O-2].[Ta+5]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15412001 0.87
SCHEMBL16669828 0.87
SCHEMBL919080 0.87
SCHEMBL10379776 0.82
SCHEMBL4956668 0.82
SCHEMBL6475092 0.82
SCHEMBL5488590 0.82
SCHEMBL2945455 0.82
SCHEMBL7729 0.82
SCHEMBL9765580 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 314 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260068548-A1 RESISTIVE SWITCHING STRUCTURE TO IMPROVE RRAM TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2026-03-05 US claimed
US-20250359079-A1 MIM CAPACITOR AND METHOD OF FORMING THE SAME TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-11-20 US claimed
US-20250234793-A1 SEMICONDUCTOR STRUCTURE INCLUDING MEMORY UNIT AND MANUFACTURING METHOD THEREOF TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) 2025-07-17 US claimed
US-12102019-B2 Data storage structure for improving memory cell reliability TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-09-24 US claimed
US-20230345847-A1 DATA STORAGE STRUCTURE FOR IMPROVING MEMORY CELL RELIABILITY TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-10-26 US claimed
CN-116282912-A High-hardness high-Young modulus ultrahigh-refractive index aluminum-tantalum oxide glass and preparation method and application thereof 中国科学院上海硅酸盐研究所 2023-06-23 CN claimed
CN-106206449-B The high yield RRAM unit of film scheme with optimization 台湾积体电路制造股份有限公司 2019-05-24 CN claimed
US-10076904-B2 Integrated circuit devices comprising memristors HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2018-09-18 US claimed
US-20180022103-A1 PRINTHEADS WITH EPROM CELLS HAVING ETCHED MULTI-METAL FLOATING GATES HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2018-01-25 US claimed
US-9876167-B2 High yield RRAM cell with optimized film scheme TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2018-01-23 US claimed
CN-1501502-A Semiconductor device and method for manufacturing the same ���µ�����ҵ��ʽ���� 2004-06-02 CN claimed
US-20040094791-A1 Semiconductor device and method for fabricating the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-05-20 US claimed
EP-1420451-A2 Semiconductor non-volatile memory device and method for fabricating the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2004-05-19 EP claimed
US-6730951-B2 Capacitor, semiconductor memory device, and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2004-05-04 US claimed
CN-1393931-A Capacitance element, semiconductor storage and preparing method thereof MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-01-29 CN claimed
EP-1271624-A2 Capacitor, semiconductor memory device, and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2003-01-02 EP claimed
US-20020195633-A1 Capacitor, semiconductor memory device, and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2002-12-26 US claimed
CN-1003752-B Ultrahigh frequency medium power load and improvement of manufacturing process thereof 上海市测试技术研究所 1989-03-29 CN claimed
CN-86106375-A Power termination and to the improvement of manufacturing process in the hyperfrequency 1988-04-06 CN claimed
CN-86207242-U UHF MIDDLE POWER LOAD 1988-03-09 CN claimed