SCHEMBL18627992

SCHEMBL18627992

CCC(C)C(C)C(N)(CN)C(C)C(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8367680 0.72
SCHEMBL21557381 0.70
SCHEMBL440679 0.67 ALDH1A1 (0.33)
SCHEMBL2283399 0.67
Hydrochloric Acid SCHEMBL28740641 0.65 ALDH1A1 (0.32)
SCHEMBL597631 0.65 TSHR (0.38)
SCHEMBL817374 0.65 ALDH1A1 (0.39)
Hydrochloric Acid SCHEMBL7753407 0.65 ALDH1A1 (0.32)
SCHEMBL28508922 0.65 TSHR (0.40)
SCHEMBL16504432 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116607132-A Plating bath composition for electroless gold plating and method of depositing gold layer 埃托特克德国有限公司 2023-08-18 CN disclosed
US-20200232099-A1 PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD AND A METHOD FOR DEPOSITING A GOLD LAYER ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2020-07-23 US disclosed
EP-3144413-B1 PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD ATOTECH DEUTSCHLAND GMBH (DE) 2018-04-25 EP disclosed
EP-3144413-A1 PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD ATOTECH Deutschland GmbH (DE) 2017-03-22 EP disclosed