SCHEMBL18663271

SCHEMBL18663271

Cc1[nH]nnc1[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL416907 0.69
SCHEMBL15858201 0.65
SCHEMBL9479124 0.63
SCHEMBL9479118 0.61
SCHEMBL5610414 0.60
SCHEMBL8313361 0.53
SCHEMBL9026428 0.53
SCHEMBL9865874 0.53
SCHEMBL5334854 0.53
SCHEMBL7407955 0.53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113169060-B Chamfering part treating agent composition and method for manufacturing wafer 中央硝子株式会社 2025-04-01 CN disclosed
CN-119278503-A Substrate processing method and substrate manufacturing method 中央硝子株式会社 2025-01-07 CN disclosed
CN-119278504-A Substrate processing method and substrate manufacturing method 中央硝子株式会社 2025-01-07 CN disclosed
CN-118451534-A Film-forming composition and method for producing substrate 中央硝子株式会社 2024-08-06 CN disclosed
US-10941301-B2 Surface treatment method, surface treatment agent, and method for forming film region-selectively on substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-09 US disclosed
US-20190203054-A1 SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND METHOD FOR FORMING FILM REGION-SELECTIVELY ON SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-04 US disclosed
US-10093815-B2 Surface treatment agent and surface treatment method TOKYO OHKA KOGYO CO., LTD. (JP) 2018-10-09 US disclosed
US-20170088722-A1 SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2017-03-30 US disclosed