SCHEMBL18700641

SCHEMBL18700641

NCCOCOCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8994245 0.89
SCHEMBL8526598 0.86 ODC1 (0.30)
SCHEMBL15931163 0.83 MEN1 (0.32)
SCHEMBL3439517 0.82
SCHEMBL8402517 0.82
SCHEMBL10024844 0.78
SCHEMBL10024845 0.78
SCHEMBL10432978 0.78 ODC1 (0.45)
SCHEMBL15743532 0.76 ODC1 (0.35)
SCHEMBL20994048 0.76 ODC1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108341951-B Dynamic polymer with hybrid cross-linked structure and application thereof 厦门天策材料科技有限公司 2023-06-20 CN claimed
EP-3391398-B1 CONDUCTIVE POLYMER DISPERSION WITH ENHANCED COVERAGE KEMET ELECTRONICS CORP (US) 2023-11-15 EP disclosed
US-20170098512-A1 Conductive Polymer Dispersion with Enhanced Coverage KEMET ELECTRONICS CORPORATION 2017-04-06 US disclosed