⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10024845 | 1.00 | — | — | |
| SCHEMBL24026165 | 0.83 | ALDH1A1 (0.30) | — | |
| SCHEMBL18700641 | 0.78 | — | — | |
| SCHEMBL201927 | 0.75 | — | — | |
| SCHEMBL5932138 | 0.72 | — | — | |
| SCHEMBL2627759 | 0.71 | — | — | |
| SCHEMBL8526598 | 0.67 | ODC1 (0.30) | — | |
| SCHEMBL204690 | 0.67 | — | — | |
| SCHEMBL203882 | 0.64 | MEN1 (0.38) | — | |
| SCHEMBL254201 | 0.64 | MEN1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| US-9123734-B2 | Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-09-01 | — | — | US | disclosed |
| US-9024455-B2 | Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-05-05 | — | — | US | disclosed |
| US-20140206148-A1 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-07-24 | — | — | US | disclosed |
| US-8674502-B2 | Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-18 | — | — | US | disclosed |
| US-20120012999-A1 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-19 | — | — | US | disclosed |
| US-20110291260-A1 | SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-12-01 | — | — | US | disclosed |
| US-20110193244-A1 | ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE | MASUKO TAKASHI | 2011-08-11 | — | — | US | disclosed |
| US-20110121435-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-26 | — | — | US | disclosed |
| US-20100178501-A1 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |