Methoxymethane

Methoxymethane

SCHEMBL1887140

CNC(N)=O.COC

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10181 0.89
SCHEMBL9157890 0.89 LMNA (0.50)
Hydrochloric Acid SCHEMBL6900073 0.85
SCHEMBL11876964 0.85
SCHEMBL28443181 0.85
Hydrochloric Acid SCHEMBL180387 0.85
SCHEMBL16584064 0.85
Urea SCHEMBL1744663 0.85
SCHEMBL14861005 0.85
Ammonia Solution, Strong SCHEMBL8332852 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109752923-A Photosensitive resin composition 三星显示有限公司 2019-05-14 CN claimed
CN-1306336-C Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2007-03-21 CN claimed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US claimed
CN-1432871-A Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2003-07-30 CN claimed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US claimed
CN-116648671-A Negative photosensitive resin composition capable of realizing low-temperature curing and low refractive index 株式会社东进世美肯 2023-08-25 CN disclosed
CN-115220303-A Photosensitive resin composition and display device comprising same 株式会社东进世美肯 2022-10-21 CN disclosed
CN-109752923-A Photosensitive resin composition 三星显示有限公司 2019-05-14 CN disclosed
US-9169409-B2 Ink composition for imprint lithography and roll printing LG DISPLAY CO., LTD. (KR) 2015-10-27 US disclosed
US-20150133582-A1 INK COMPOSITION FOR IMPRINT LITHOGRAPHY AND ROLL PRINTING LG DISPLAY CO., LTD. (KR) 2015-05-14 US disclosed
CN-101735690-B Ink composition and method of fabricating liquid crystal display device using same LG DISPLAY CO LTD 2014-05-14 CN disclosed
US-8492459-B2 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2013-07-23 US disclosed
US-20100079547-A1 INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-04-01 US disclosed
US-20090176936-A1 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2009-07-09 US disclosed
CN-101457050-A Ink combination and method for forming patterns using the ink combination LG DISPLAY CO LTD (KR) 2009-06-17 CN disclosed
CN-1983031-A Photosensitive resin composition for organic light emitting diodes DONGJIN SEMICHEM CO LTD (KR) 2007-06-20 CN disclosed
CN-1306336-C Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2007-03-21 CN disclosed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US disclosed
CN-1432871-A Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2003-07-30 CN disclosed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US disclosed