Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 8/20 | 0.76 |
| ▸ | PTGS1 | P23219 | 7/20 | 0.76 |
| ▸ | PTGS2 | P35354 | 7/20 | 0.76 |
| ▸ | FAAH | O00519 | 5/20 | 0.76 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.59 |
| ▸ | LMNA | P02545 | 3/20 | 0.59 |
| ▸ | MAPT | P10636 | 2/20 | 0.59 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.59 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.59 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.59 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.59 |
| ▸ | TP53 | P04637 | 1/20 | 0.59 |
| ▸ | PKM | P14618 | 1/20 | 0.59 |
| ▸ | HPGD | P15428 | 1/20 | 0.59 |
| ▸ | XBP1 | P17861 | 1/20 | 0.59 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.59 |
| ▸ | HTT | P42858 | 1/20 | 0.59 |
| ▸ | RECQL | P46063 | 1/20 | 0.59 |
| ▸ | RAB9A | P51151 | 1/20 | 0.59 |
| ▸ | GPR35 | Q9HC97 | 1/20 | 0.59 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23713510 | 0.90 | MGLL (0.76) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL634042 | 0.88 | MGLL (0.79) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL15854884 | 0.88 | MGLL (0.79) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL15853885 | 0.88 | MGLL (0.79) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL209436 | 0.87 | MGLL (1.00) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL9640374 | 0.87 | MGLL (1.00) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL36400 | 0.87 | MGLL (1.00) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL2181536 | 0.87 | MGLL (1.00) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL9497658 | 0.87 | MGLL (1.00) | MGLLPTGS1PTGS2FAAHALDH1A1 | |
| SCHEMBL208653 | 0.87 | MGLL (1.00) | MGLLPTGS1PTGS2FAAHALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3950334-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-08-16 | — | — | EP | disclosed |
| EP-3916025-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-08-09 | — | — | EP | disclosed |
| EP-3919531-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-08-02 | — | — | EP | disclosed |
| US-11680139-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-06-20 | — | — | US | disclosed |
| US-11643493-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-05-09 | — | — | US | disclosed |
| WO-2022264987-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264985-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264984-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264994-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| US-20220204810-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-06-30 | — | — | US | disclosed |
| US-11236227-B2 | Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2022-02-01 | — | — | US | disclosed |
| EP-3919531-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-08 | — | — | EP | disclosed |
| EP-3916025-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-12-01 | — | — | EP | disclosed |
| WO-2021154898-A2 | UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS | DESIGNER MOLECULES, INC (US) | 2021-08-05 | — | — | WO | disclosed |
| US-20210206892-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-07-08 | — | — | US | disclosed |
| EP-3845575-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-07-07 | — | — | EP | disclosed |
| US-10893603-B2 | Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2021-01-12 | — | — | US | disclosed |
| WO-2020262579-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2020-12-30 | — | — | WO | disclosed |
| WO-2020116467-A1 | THERMOSETTING RESIN COMPOSITION AND SHEET | ナガセケムテックス株式会社 | 2020-06-11 | — | — | WO | disclosed |
| US-20170152418-A1 | MALEIMIDE FILM | FURUKAWA ELECTRIC CO., LTD. (JP) | 2017-06-01 | — | — | US | disclosed |