SCHEMBL18927062

SCHEMBL18927062

CC(C)(C1CCC(OCC(O)COCC2CC2)CC1)C1CCC(OCC(O)COCC2CO2)CC1

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 5/20 0.40
KMT2A Q03164 5/20 0.40
HTT P42858 2/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
SMN1; SMN2 Q16637 3/20 0.39
TSHR P16473 3/20 0.38
NPSR1 Q6W5P4 1/20 0.38
MAPK1 P28482 1/20 0.36
MAPT P10636 2/20 0.34
CYP2D6 P10635 1/20 0.34
ALDH1A1 P00352 4/20 0.33
LMNA P02545 1/20 0.33
GAA P10253 1/20 0.33
TDP1 Q9NUW8 1/20 0.31
PRMT5 O14744 1/20 0.30
WDR77 Q9BQA1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18927063 0.96 MEN1 (0.43) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL13146717 0.90 MEN1 (0.42) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL15356260 0.88 MEN1 (0.45) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL4753042 0.88 MEN1 (0.45) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL18935669 0.86 MEN1 (0.39) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL19051889 0.82 TSHR (0.43) MEN1KMT2ASMN1; SMN2TSHRMAPK1
SCHEMBL13399052 0.82 TSHR (0.47) MEN1KMT2ASMN1; SMN2TSHRMAPK1
SCHEMBL4753133 0.82 MEN1 (0.42) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL19728213 0.81 MEN1 (0.40) MEN1KMT2AHTTL3MBTL1SMN1; SMN2
SCHEMBL15831674 0.80 TSHR (0.45) MEN1KMT2ASMN1; SMN2TSHRMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170158932-A1 EPOXY RESIN COMPOSITIONS AND THERMAL INTERFACE MATERIALS COMPRISING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2017-06-08 US disclosed