SCHEMBL1895280

SCHEMBL1895280

C=C(C(=O)OC)C(C)N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3909058 0.79
SCHEMBL10705663 0.78 TSHR (0.40)
Ammonia Solution, Strong SCHEMBL28843678 0.77 ALDH1A1 (0.48)
SCHEMBL599284 0.77
SCHEMBL3859257 0.77
SCHEMBL3855198 0.77
SCHEMBL29001043 0.76 ALDH1A1 (0.42)
SCHEMBL6656474 0.75
SCHEMBL6659311 0.75
SCHEMBL3293587 0.75 ALDH1A1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220332986-A1 (METH)ACRYLIC ADHESIVE FILM, OPTICAL MEMBER COMPRISING THE SAME, AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME SAMSUNG SDI CO., LTD. (KR) 2022-10-20 US disclosed
CN-106536676-B Luminescent film 株式会社LG化学 2019-08-16 CN disclosed
CN-106663726-B Luminescent film 株式会社LG化学 2019-04-23 CN disclosed
CN-109100841-A Optical fiber and fibre ribbon 住友电气工业株式会社 2018-12-28 CN disclosed
CN-105637057-B Pressure sensitive adhesive composition LG化学株式会社 2018-06-08 CN disclosed
CN-105705571-B Conductive polyethylene resin composition, and molded article and laminate using same 日本聚乙烯株式会社 2018-04-10 CN disclosed
CN-107001866-A Patch material 日绊株式会社 2017-08-01 CN disclosed
CN-104736580-B Aqueous dispersion Pioloform, polyvinyl acetal particulate 积水化学工业株式会社 2017-08-01 CN disclosed
CN-106663726-A Luminescent film 株式会社LG化学 2017-05-10 CN disclosed
CN-106536676-A Luminescent film 株式会社LG化学 2017-03-22 CN disclosed
CN-102639097-A Reverse temperature-sensitive reversible hydrogel composition BRODA TECHNOLOGIES CO LTD 2012-08-15 CN disclosed
US-8178198-B2 Adhesive sheet LINTEC CORPORATION (JP) 2012-05-15 US disclosed
US-20110195561-A1 ADHESIVE SHEET LINTEC CORPORATION (JP) 2011-08-11 US disclosed
US-7935424-B2 Substrate with a curable adhesive layer of acrylic copolymer from dialkyl(meth)acrylamide, a phenol EO modified (meth)acrylate, a (meth)acryloyl morpholine, or a (meth)acrylate that has an aceto-acetoxyl group and a urethane acrylate; bonding to uneven circuit surface of a wafer LINTEC CORPORATION (JP) 2011-05-03 US disclosed
US-7726802-B2 Ink set for inkjet recording, and image recording method and image recording apparatus FUJIFILM CORPORATION (JP) 2010-06-01 US disclosed
US-20080233392-A1 ADHESIVE SHEET LINTEC CORPORATION (JP) 2008-09-25 US disclosed
US-20070238805-A1 ADHESIVE SHEET LINTEC CORPORATION (JP) 2007-10-11 US disclosed
US-20070229577-A1 Ink set for inkjet recording, and image recording method and image recording apparatus FUJIFILM CORPORATION (JP) 2007-10-04 US disclosed
US-20070222832-A1 Ink tank assembly for inkjet system, and image forming apparatus FUJIFILM CORPORATION 2007-09-27 US disclosed
CN-1912042-A Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board NITTO DENKO CORP (JP) 2007-02-14 CN disclosed