SCHEMBL18969679

SCHEMBL18969679

COC(C)c1c(C)c(O)c(C)c(C)c1O

nearest known ligand 0.39

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
EGFR P00533 2/20 0.39
CDK4 P11802 2/20 0.39
CCND1 P24385 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14031709 0.88 EGFR (0.34) EGFRCDK4CCND1
SCHEMBL14031711 0.71
SCHEMBL22991644 0.67 EGFR (0.35) EGFRCDK4CCND1
SCHEMBL22991614 0.67 EGFR (0.35) EGFRCDK4CCND1
Durohydroquinone SCHEMBL69786 0.66 ALOX5 (0.38)
SCHEMBL31146654 0.66
SCHEMBL4967470 0.66 BCL2 (0.34)
SCHEMBL22991629 0.65 EGFR (0.34) EGFRCDK4CCND1
SCHEMBL22991645 0.64 TTR (0.42) EGFRCDK4CCND1
SCHEMBL22991647 0.64 EGFR (0.33) EGFRCDK4CCND1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170168395-A1 ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, MASK BLANK PROVIDED WITH ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2017-06-15 US disclosed
US-20170168395-A1 ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, MASK BLANK PROVIDED WITH ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2017-06-15 US disclosed