SCHEMBL19007367

SCHEMBL19007367

CCC(C)(c1ccc(OC(=O)c2ccc(C(=O)Oc3ccccc3OC)cc2)cc1)c1ccc(C(C)(C)OC(=O)c2ccc(C(=O)Oc3ccc(C(C)(CC)c4ccc(C(C)(C)OC(=O)c5ccc(C(=O)Oc6ccccc6OC)cc5)cc4)cc3)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.47
NPSR1 Q6W5P4 2/20 0.47
L3MBTL1 Q9Y468 3/20 0.46
TDP1 Q9NUW8 2/20 0.46
PRSS1 P07477 3/20 0.44
ACR P10323 3/20 0.44
TSHR P16473 1/20 0.43
KMT2A Q03164 5/20 0.40
PARP10 Q53GL7 1/20 0.39
MEN1 O00255 2/20 0.39
CYP3A4 P08684 1/20 0.39
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
NPC1 O15118 1/20 0.38
PTPN1 P18031 1/20 0.38
ALDH1A1 P00352 1/20 0.38
LPAR1 Q92633 1/20 0.37
LPAR5 Q9H1C0 1/20 0.37
LMNA P02545 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18969720 0.93 MAPT (0.53) MAPTNPSR1L3MBTL1TDP1PRSS1
SCHEMBL19007365 0.89 MAPT (0.51) MAPTNPSR1L3MBTL1TDP1PRSS1
SCHEMBL19007369 0.86 MAPT (0.51) MAPTNPSR1L3MBTL1TDP1PRSS1
SCHEMBL19007366 0.86 HPGD (0.55) MAPTNPSR1L3MBTL1TDP1PRSS1
SCHEMBL18969715 0.81 MAPT (0.58) MAPTNPSR1L3MBTL1TDP1PRSS1
SCHEMBL141556 0.77 CA1 (0.58) MAPTL3MBTL1TDP1PRSS1ACR
SCHEMBL12352685 0.74 MAPT (0.46) MAPTL3MBTL1TDP1PRSS1ACR
SCHEMBL21159215 0.73 KMT2A (0.67) MAPTL3MBTL1PRSS1ACRKMT2A
SCHEMBL16578024 0.73 MAPT (0.45) MAPTL3MBTL1TDP1PRSS1ACR
SCHEMBL18591531 0.73 MAPT (0.47) MAPTL3MBTL1TDP1PRSS1ACR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3181608-A1 AN EPOXY RESIN CURING AGENT AND PREPARATION METHODS AND USES THEREOF Guangdong Guangshan New Materials Co., Ltd. (CN) 2017-06-21 EP disclosed