⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzene SCHEMBL4450136 | 0.93 | TP53 (0.50) | — | |
| Benzene SCHEMBL4326692 | 0.93 | — | — | |
| Benzene SCHEMBL28488648 | 0.76 | — | — | |
| Benzene SCHEMBL5317629 | 0.76 | TSHR (0.75) | — | |
| Benzene SCHEMBL190779 | 0.76 | — | — | |
| Hydrogen Peroxide SCHEMBL2891296 | 0.76 | — | — | |
| Methane SCHEMBL7713958 | 0.76 | — | — | |
| Benzene SCHEMBL6889012 | 0.76 | TSHR (0.75) | — | |
| Methane SCHEMBL125054 | 0.76 | — | — | |
| Benzene SCHEMBL891552 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023195268-A1 | SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, SILICONE PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE FILM, IMAGE DISPLAY DEVICE, AND METHOD FOR EVALUATING SILICONE PRESSURE-SENSITIVE ADHESIVE | 信越化学工業株式会社 | 2023-10-12 | — | — | WO | disclosed |
| WO-2022196410-A1 | ELECTROCONDUCTIVE SILICONE COMPOSITION, ELECTROCONDUCTIVE SILICONE CURED PRODUCT AND LAMINATE | 信越化学工業株式会社 | 2022-09-22 | — | — | WO | disclosed |
| WO-2021152972-A1 | ELECTROCONDUCTIVE SILICONE COMPOSITION, CURED ELECTROCONDUCTIVE SILICONE, METHOD FOR PRODUCING CURED ELECTROCONDUCTIVE SILICONE, AND LAMINATE | 信越化学工業株式会社 | 2021-08-05 | — | — | WO | disclosed |
| WO-2021095495-A1 | CONDUCTIVE SILICONE COMPOSITION, CURED CONDUCTIVE SILICONE PRODUCT, PRODUCTION METHOD FOR CURED CONDUCTIVE SILICONE PRODUCT, AND CONDUCTIVE SILICONE LAMINATE | 信越化学工業株式会社 | 2021-05-20 | — | — | WO | disclosed |
| EP-2892953-B1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | DOW TORAY CO LTD (JP) | 2020-08-26 | — | — | EP | disclosed |
| US-9403982-B2 | Curable silicone composition and cured product thereof | DOW CORNING CORPORATION (US) | 2016-08-02 | — | — | US | disclosed |
| US-20150344636-A1 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device | DOW CORNING TORAY CO., LTD. (JP) | 2015-12-03 | — | — | US | disclosed |
| EP-2760939-B1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | DOW CORNING TORAY CO LTD (JP) | 2015-10-21 | — | — | EP | disclosed |
| US-20150210853-A1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | DOW CORNING TORAY CO., LTD. (JP) | 2015-07-30 | — | — | US | disclosed |
| EP-2892953-A1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | Dow Corning Toray Co., Ltd. (JP) | 2015-07-15 | — | — | EP | disclosed |
| US-20110227235-A1 | Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device | DOW TORAY CO., LTD. (JP) | 2011-09-22 | — | — | US | disclosed |
| EP-2352794-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2011-08-10 | — | — | EP | disclosed |
| EP-2324079-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2011-05-25 | — | — | EP | disclosed |
| WO-2010050625-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD. (JP) | 2010-05-06 | — | — | WO | disclosed |
| WO-2010027105-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD. (JP) | 2010-03-11 | — | — | WO | disclosed |
| WO-2003080753-A1 | SILICONE RESINS AND THEIR PREPARATION | DOW CORNING CORPORATION (US) | 2003-10-02 | — | — | WO | disclosed |
| US-5840220-A | HEATING MIXTURE OF POLYSILOXANE OIL, THERMOPLASTIC RESIN, AND HEAT ACTIVATED BLOWING AGENT, THICKENER; FOR VIBRATION DAMPING OPTICAL DEVICES | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1998-11-24 | — | — | US | disclosed |
| US-5661203-A | COMPOSITION CONSISTING OF POLYORGANOSILOXANE OIL, FINELY DIVIDED HOLLOW PARTICLES OF THERMOPLASTIC ORGANIC RESIN, THICKENER; VIBRATION-DAMPING MATERIAL | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1997-08-26 | — | — | US | disclosed |
| EP-0635549-B1 | Organosiloxane composition and method for preparing same | DOW CORNING TORAY SILICONE (JP) | 1997-06-11 | — | — | EP | disclosed |
| EP-0635549-A1 | Organosiloxane composition and method for preparing same | Dow Corning Toray Silicone Company, Limited (JP) | 1995-01-25 | — | — | EP | disclosed |