Benzene

Benzene

SCHEMBL4450136

O[SiH3].c1ccccc1.c1ccccc1

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.50
TSHR P16473 1/20 0.50
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
GLA P06280 1/20 0.31
CA3 P07451 1/20 0.31
CA4 P22748 1/20 0.31
CA9 Q16790 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
CA14 Q9ULX7 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzene SCHEMBL4326692 1.00
Benzene SCHEMBL1901116 0.93
Benzene SCHEMBL190779 0.82
Benzene SCHEMBL6889012 0.82 TSHR (0.75) TP53TSHRCA12CA1CA2
Hydrogen Peroxide SCHEMBL2891296 0.82
SCHEMBL1112772 0.71 TSHR (1.00) TP53TSHRTDP1
Benzene SCHEMBL8576855 0.71 TSHR (1.00) TP53TSHRTDP1
SCHEMBL1086976 0.71 TSHR (1.00) TP53TSHRTDP1
Benzene SCHEMBL8107103 0.71 TSHR (1.00) TP53TSHRTDP1
Benzene SCHEMBL8022649 0.71 TSHR (1.00) TP53TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023195268-A1 SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, SILICONE PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE FILM, IMAGE DISPLAY DEVICE, AND METHOD FOR EVALUATING SILICONE PRESSURE-SENSITIVE ADHESIVE 信越化学工業株式会社 2023-10-12 WO disclosed
WO-2022196410-A1 ELECTROCONDUCTIVE SILICONE COMPOSITION, ELECTROCONDUCTIVE SILICONE CURED PRODUCT AND LAMINATE 信越化学工業株式会社 2022-09-22 WO disclosed
WO-2021152972-A1 ELECTROCONDUCTIVE SILICONE COMPOSITION, CURED ELECTROCONDUCTIVE SILICONE, METHOD FOR PRODUCING CURED ELECTROCONDUCTIVE SILICONE, AND LAMINATE 信越化学工業株式会社 2021-08-05 WO disclosed
WO-2021095495-A1 CONDUCTIVE SILICONE COMPOSITION, CURED CONDUCTIVE SILICONE PRODUCT, PRODUCTION METHOD FOR CURED CONDUCTIVE SILICONE PRODUCT, AND CONDUCTIVE SILICONE LAMINATE 信越化学工業株式会社 2021-05-20 WO disclosed
US-20210114903-A1 SHEET LAMINATE, METHOD FOR MANUFACTURING GAS SUPPLY BODY, GAS SUPPLY BODY, SUPPLY BODY UNIT, AND WASTEWATER TREATMENT DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2021-04-22 US disclosed
EP-3778498-A1 SHEET LAMINATE, METHOD FOR MANUFACTURING GAS SUPPLY BODY, GAS SUPPLY BODY, SUPPLY BODY UNIT, AND WASTEWATER TREATMENT DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2021-02-17 EP disclosed
US-20090020213-A1 SILICONE RUBBER COMPOSITION FOR SEALING STITCHED AIR BAG SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-01-22 US disclosed
US-20070100065-A1 SILICONE RUBBER COMPOSITION FOR SEALING STITCHED AIR BAG SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-03 US disclosed