SCHEMBL1905150

SCHEMBL1905150

CC[N+]1=C2CCCN2CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL809811 0.92 USP2 (0.31)
Water SCHEMBL15062427 0.90
Iodide SCHEMBL15767240 0.90
Hydrochloric Acid SCHEMBL9328053 0.90
Bromide SCHEMBL755393 0.90 BCHE (0.32)
Bromide SCHEMBL14993400 0.80
SCHEMBL3243284 0.77
Bromide SCHEMBL14993579 0.77 CCR5 (0.34)
Bromide SCHEMBL14993401 0.77 CCR5 (0.34)
Bromide SCHEMBL14993438 0.77 CCR5 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP claimed
EP-3232455-B1 NONAQUEOUS ELECTROLYTE SOLUTION FOR ELECTRIC DOUBLE LAYER CAPACITORS OTSUKA CHEMICAL CO LTD (JP) 2023-10-25 EP disclosed
US-11597818-B2 Molded article FURUKAWA ELECTRIC CO., LTD. (JP) 2023-03-07 US disclosed
US-11597817-B2 Thermoplastic resin composition, method of producing thermoplastic resin composition, molded article of cellulose-reinforced resin, and method of producing molded article of cellulose-reinforced resin FURUKAWA ELECTRIC CO., LTD (JP) 2023-03-07 US disclosed
EP-3438186-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-22 EP disclosed
EP-3438207-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-15 EP disclosed
US-11578192-B2 Molded article FURUKAWA ELECTRIC CO., LTD. (JP) 2023-02-14 US disclosed
US-11530316-B2 2022-12-20 US disclosed
EP-3689974-A1 MOLDED ARTICLE Furukawa Electric Co., Ltd. (JP) 2020-08-05 EP disclosed
EP-3689972-A1 MOLDED ARTICLE Furukawa Electric Co., Ltd. (JP) 2020-08-05 EP disclosed
US-20090103241-A1 Activated carbon prepared by carbonizing and activating a calixarene containing dihydroxybenzene rings; especially calcining at 400 degrees C. or less in the presence of an oxidative gas, calcining at 1500 degrees or less in an inactive gas, and then further calcining at 200-1500 degrees in H2O or CO2 SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2009-04-23 US disclosed
EP-2048131-A1 IONIC COMPOUND Nichicon Corporation (JP) 2009-04-15 EP disclosed
US-20080094777-A1 Electric double layer capacitor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2008-04-24 US disclosed
US-20080083626-A1 IONIC COMPOUND NICHICON CORPORATION (JP) 2008-04-10 US disclosed
EP-1905740-A1 ELECTRIC DOUBLE LAYER CAPACITOR Sumitomo Chemical Company, Limited (JP) 2008-04-02 EP disclosed
EP-1876611-A1 ELECTRIC DOUBLE LAYER CAPACITOR Sumitomo Chemical Company, Limited (JP) 2008-01-09 EP disclosed
US-7099146-B2 Electrolyte for electrochemical capacitor and electrochemical capacitor containing the same SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2006-08-29 US disclosed
US-20060087798-A1 Electrolyte for electrochemical capacitor and electrochemical capacitor containing the same SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2006-04-27 US disclosed
EP-1548769-A1 ELECTROLYTE FOR ELECTROCHEMICAL CAPACITOR AND ELECTROCHEMICAL CAPACITOR CONTAINING THE SAME SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2005-06-29 EP disclosed
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP disclosed